- 25 C Memory ICs

Results: 85
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Product Type Mounting Style Package/Case Memory Size Interface Type
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Rp296.838,28
Min.: 1.050
Mult.: 1.050
eMMC BGA-153 32 GB eMMC 5.1
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Rp447.092,02
Min.: 760
Mult.: 760
eMMC FBGA-153 64 GB eMMC 5.1 HS400
ATP Electronics eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE) Non-Stocked Lead-Time 40 Weeks
Rp707.238,30
Min.: 1.050
Mult.: 1.050
eMMC BGA-153 64 GB eMMC 5.1
ATP Electronics eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC Non-Stocked Lead-Time 29 Weeks
Rp190.981,86
Rp177.589,28
Rp172.085,48
Rp168.049,36
Min.: 1
Mult.: 1
eMMC FBGA-153
ATP Electronics eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC Non-Stocked Lead-Time 29 Weeks
Rp216.666,26
Min.: 760
Mult.: 760
eMMC FBGA-153
ATP Electronics eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC Non-Stocked Lead-Time 40 Weeks
Rp496.626,22
Min.: 760
Mult.: 760
eMMC FBGA-153 16 GB eMMC 5.1
ATP Electronics eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC Non-Stocked Lead-Time 40 Weeks
Rp286.381,06
Min.: 760
Mult.: 760
eMMC FBGA-153
Alliance Memory DRAM LPDDR2, 256M, 8M X 32, 1.2V, 168-Ball POP FBGA Extended temp - Tray Non-Stocked Lead-Time 35 Weeks
Rp414.436,14
Rp384.165,24
Rp372.056,88
Rp362.883,88
Rp349.307,84
Min.: 1
Mult.: 1
DRAM SMD/SMT FBGA-168 256 Mbit
Alliance Memory DRAM LPDDR2, 256Mb, 8M X 32, 1.2V, 134ball BGA Commercial Extended temp - Tape & Reel Non-Stocked Lead-Time 35 Weeks
Reel
Rp315.367,74
Min.: 1.000
Mult.: 1.000
: 1.000
DRAM SMD/SMT FBGA-134 256 Mbit
Alliance Memory DRAM LPDDR1, 2G, 64M x 32, 1.8v, 200 MHz 90-BALL FBGA, Commercial Temp - Tray Non-Stocked Lead-Time 20 Weeks
Rp509.101,50
Rp471.675,66
Rp456.815,40
Rp445.624,34
Min.: 1
Mult.: 1
DRAM SMD/SMT FBGA-90 2 Gbit