|
|
DRAM SPCM
Infineon Technologies S80KS2562GABHV020
- S80KS2562GABHV020
- Infineon Technologies
-
1:
Rp184.744
-
Non-Stocked Lead-Time 26 Weeks
|
Mouser Part No
727-S2562GABHV020
|
Infineon Technologies
|
DRAM SPCM
|
|
Non-Stocked Lead-Time 26 Weeks
|
|
|
Rp184.744
|
|
|
Rp171.902
|
|
|
Rp166.582
|
|
|
Rp162.546
|
|
|
View
|
|
|
Rp158.693
|
|
|
Rp153.373
|
|
Min.: 1
Mult.: 1
|
|
|
HyperRAM
|
256 Mbit
|
8 bit
|
200 MHz
|
FBGA-24
|
32 M x 8
|
35 ns
|
1.7 V
|
2 V
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
DRAM SPCM
Infineon Technologies S27KL0643GABHV020
- S27KL0643GABHV020
- Infineon Technologies
-
3.380:
Rp82.374
-
Non-Stocked Lead-Time 26 Weeks
|
Mouser Part No
727-S27KL0643GABHV20
|
Infineon Technologies
|
DRAM SPCM
|
|
Non-Stocked Lead-Time 26 Weeks
|
|
Min.: 3.380
Mult.: 3.380
|
|
|
HyperRAM
|
64 Mbit
|
8 bit
|
200 MHz
|
|
8 M x 8
|
35 ns
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
DRAM SPCM
Infineon Technologies S70KL1283DPBHV020
- S70KL1283DPBHV020
- Infineon Technologies
-
3.380:
Rp102.738
-
Non-Stocked Lead-Time 26 Weeks
|
Mouser Part No
727-S70KL1283DPBHV2
|
Infineon Technologies
|
DRAM SPCM
|
|
Non-Stocked Lead-Time 26 Weeks
|
|
Min.: 3.380
Mult.: 3.380
|
|
|
HyperRAM
|
128 Mbit
|
8 bit
|
166 MHz
|
|
16 M x 8
|
36 ns
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
DRAM IoT RAM 128Mb OPI (x8) DDR 200MHz, 1.8V, Ind. Temp., WLCSP
AP Memory APS12808O-OBR-WB
- APS12808O-OBR-WB
- AP Memory
-
5.000:
Rp49.901
-
Non-Stocked Lead-Time 15 Weeks
|
Mouser Part No
878-APS12808O-OBR-WB
|
AP Memory
|
DRAM IoT RAM 128Mb OPI (x8) DDR 200MHz, 1.8V, Ind. Temp., WLCSP
|
|
Non-Stocked Lead-Time 15 Weeks
|
|
Min.: 5.000
Mult.: 5.000
:
5.000
|
|
|
PSRAM (Pseudo SRAM)
|
128 Mbit
|
8 bit
|
200 MHz
|
WLCSP-15
|
16 M x 8
|
|
1.62 V
|
1.98 V
|
- 40 C
|
+ 85 C
|
|
Reel
|
|
|
|
DRAM 32Mb, SerialRAM, Continuous Operation, 1.65V-1.95V, 104MHz, 8 pin SOIC 150 mil, RoHS
- IS66WVR4M8ALL-104NLI-TR
- ISSI
-
3.000:
Rp52.653
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
870-VR4M8ALL104NLITR
|
ISSI
|
DRAM 32Mb, SerialRAM, Continuous Operation, 1.65V-1.95V, 104MHz, 8 pin SOIC 150 mil, RoHS
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 3.000
Mult.: 3.000
:
3.000
|
|
|
PSRAM (Pseudo SRAM)
|
32 Mbit
|
8 bit
|
104 MHz
|
SOIC-8
|
4 M x 8
|
7 ns
|
1.65 V
|
1.95 V
|
- 40 C
|
+ 85 C
|
|
Reel
|
|
|
|
DRAM 32Mb, SerialRAM, Continuous Operation, 2.7V-3.6V, 104MHz, 8 pin SOIC 150 mil, RoHS
- IS66WVR4M8BLL-104NLI-TR
- ISSI
-
3.000:
Rp52.653
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
870-VR4M8BLL104NLITR
|
ISSI
|
DRAM 32Mb, SerialRAM, Continuous Operation, 2.7V-3.6V, 104MHz, 8 pin SOIC 150 mil, RoHS
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 3.000
Mult.: 3.000
:
3.000
|
|
|
PSRAM (Pseudo SRAM)
|
32 Mbit
|
8 bit
|
104 MHz
|
SOIC-8
|
4 M x 8
|
7 ns
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
Reel
|
|
|
|
DRAM 1G, 1.8V, 128M x 16 DDR2 C Temp
- AS4C128M8D2A-25BCNTR
- Alliance Memory
-
2.000:
Rp419.756
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-4C128M8D2A25BCNT
|
Alliance Memory
|
DRAM 1G, 1.8V, 128M x 16 DDR2 C Temp
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 2.000
Mult.: 2.000
:
2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
8 bit
|
400 MHz
|
FBGA-60
|
128 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 95 C
|
AS4C128M8D2A
|
Reel
|
|
|
|
DRAM 1G, 1.8V, 128M x 16 DDR2 I Temp
- AS4C128M8D2A-25BINTR
- Alliance Memory
-
2.000:
Rp440.304
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-4C128M8D2A25BINT
|
Alliance Memory
|
DRAM 1G, 1.8V, 128M x 16 DDR2 I Temp
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 2.000
Mult.: 2.000
:
2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
8 bit
|
400 MHz
|
FBGA-60
|
128 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
AS4C128M8D2A
|
Reel
|
|
|
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tray
- AS4C64M8D1-5BCN
- Alliance Memory
-
1:
Rp406.731
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D1-5BCN
|
Alliance Memory
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tray
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
|
Rp406.731
|
|
|
Rp377.010
|
|
|
Rp365.269
|
|
|
Rp356.279
|
|
|
View
|
|
|
Rp342.887
|
|
|
Rp334.081
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR
|
512 Mbit
|
8 bit
|
200 MHz
|
FBGA-60
|
64 M x 8
|
700 ps
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
AS4C64M8D1
|
Tray
|
|
|
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tape & Reel
- AS4C64M8D1-5BCNTR
- Alliance Memory
-
2.500:
Rp259.412
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D1-5BCNT
|
Alliance Memory
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM - DDR
|
512 Mbit
|
8 bit
|
200 MHz
|
FBGA-60
|
64 M x 8
|
700 ps
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
AS4C64M8D1
|
Reel
|
|
|
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Industrial Temp - Tape & Reel
- AS4C64M8D1-5BINTR
- Alliance Memory
-
2.500:
Rp280.143
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D1-5BINT
|
Alliance Memory
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Industrial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM - DDR
|
512 Mbit
|
8 bit
|
200 MHz
|
FBGA-60
|
64 M x 8
|
700 ps
|
2.3 V
|
2.7 V
|
- 40 C
|
+ 85 C
|
AS4C64M8D1
|
Reel
|
|
|
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Commercial Temp - Tape & Reel
- AS4C64M8D2-25BCNTR
- Alliance Memory
-
2.000:
Rp323.623
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D225BCNT
|
Alliance Memory
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Commercial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.000
Mult.: 2.000
:
2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
8 bit
|
400 MHz
|
FBGA-60
|
64 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
AS4C64M8D2
|
Reel
|
|
|
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Industrial Temp - Tape & Reel
- AS4C64M8D2-25BINTR
- Alliance Memory
-
2.000:
Rp344.538
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D225BINT
|
Alliance Memory
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Industrial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.000
Mult.: 2.000
:
2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
8 bit
|
400 MHz
|
FBGA-60
|
64 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
AS4C64M8D2
|
Reel
|
|
|
|
DRAM 512Mb 64Mx8 3.3V 143MHz SDRAM I-Temp
- AS4C64M8SC-7TINTR
- Alliance Memory
-
1.000:
Rp440.304
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-AS4C64M8SC7TINTR
|
Alliance Memory
|
DRAM 512Mb 64Mx8 3.3V 143MHz SDRAM I-Temp
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1.000
Mult.: 1.000
:
1.000
|
|
|
SDRAM
|
512 Mbit
|
8 bit
|
133 MHz
|
TSOP-II-54
|
64 M x 8
|
17 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
AS4C64M8SC
|
Reel
|
|
|
|
DRAM SDRAM 512Mb (64Mx8), 3.3V, 54p TSOP II, 133MHz, Commercial Temp, Rev.D
- AS4C64M8SD-7TCN
- Alliance Memory
-
108:
Rp420.307
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-AS4C64M8SD-7TCN
|
Alliance Memory
|
DRAM SDRAM 512Mb (64Mx8), 3.3V, 54p TSOP II, 133MHz, Commercial Temp, Rev.D
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
|
Rp420.307
|
|
|
Rp409.666
|
|
Min.: 108
Mult.: 108
|
|
|
SDRAM
|
512 Mbit
|
8 bit
|
133 MHz
|
TSOP-II-54
|
64 M x 8
|
6 ns
|
3 V
|
3.6 V
|
0 C
|
+ 70 C
|
|
Tray
|
|
|
|
DRAM SDRAM 512Mb (64Mx8), 3.3V, 54p TSOP II, 133MHz, Commercial Temp, Rev.D, T&R
- AS4C64M8SD-7TCNTR
- Alliance Memory
-
1.500:
Rp323.623
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-AS4C64M8SD7TCNTR
|
Alliance Memory
|
DRAM SDRAM 512Mb (64Mx8), 3.3V, 54p TSOP II, 133MHz, Commercial Temp, Rev.D, T&R
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1.500
Mult.: 1.500
:
1.500
|
|
|
SDRAM
|
512 Mbit
|
8 bit
|
133 MHz
|
TSOP-II-54
|
64 M x 8
|
6 ns
|
3 V
|
3.6 V
|
0 C
|
+ 70 C
|
|
Reel
|
|
|
|
DRAM DDR2 1Gb, 128Mx8, 800 at CL5, 1.8V, FBGA-60
- A3R1GE30JBF-8E
- Zentel Japan
-
1:
Rp203.641
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3R1GE30JBF-8E
|
Zentel Japan
|
DRAM DDR2 1Gb, 128Mx8, 800 at CL5, 1.8V, FBGA-60
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp203.641
|
|
|
Rp189.331
|
|
|
Rp183.460
|
|
|
Rp179.057
|
|
|
View
|
|
|
Rp174.654
|
|
|
Rp168.967
|
|
|
Rp164.747
|
|
|
Rp160.344
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR2
|
1 Gbit
|
8 bit
|
400 MHz
|
FPGA-60
|
128 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78
- A3T1GF30CBF-GM
- Zentel Japan
-
2.200:
Rp194.468
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GM
|
Zentel Japan
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
0 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
- A3T1GF30CBF-GMI
- Zentel Japan
-
2.200:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GMI
|
Zentel Japan
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78
- A3T1GF30CBF-GML
- Zentel Japan
-
2.200:
Rp194.468
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GML
|
Zentel Japan
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
0 C
|
+ 95 C
|
DDR3L
|
Tray
|
|
|
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78, Ind. Temp.
- A3T1GF30CBF-GMLI
- Zentel Japan
-
2.200:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GMLI
|
Zentel Japan
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3L
|
Tray
|
|
|
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78
- A3T2GF30CBF-HP
- Zentel Japan
-
2.420:
Rp293.536
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3T2GF30CBF-HP
|
Zentel Japan
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3L
|
2 Gbit
|
8 bit
|
933 MHz
|
FPGA-78
|
256 M x 8
|
|
1.283 V
|
1.575 V
|
0 C
|
+ 95 C
|
DDR3(L)
|
Tray
|
|
|
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
- A3T2GF30CBF-HPI
- Zentel Japan
-
2.420:
Rp372.791
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T2GF30CBF-HPI
|
Zentel Japan
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3L
|
2 Gbit
|
8 bit
|
933 MHz
|
FPGA-78
|
256 M x 8
|
|
1.283 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3(L)
|
Tray
|
|
|
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78
- A3T2GF30CBF-JR
- Zentel Japan
-
2.420:
Rp293.536
-
Non-Stocked Lead-Time 24 Weeks
|
Mouser Part No
155-A3T2GF30CBF-JR
|
Zentel Japan
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78
|
|
Non-Stocked Lead-Time 24 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3
|
2 Gbit
|
8 bit
|
1.066 GHz
|
FPGA-78
|
256 M x 8
|
|
1.425 V
|
1.575 V
|
0 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
- A3T2GF30CBF-JRI
- Zentel Japan
-
2.420:
Rp385.266
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3T2GF30CBF-JRI
|
Zentel Japan
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3
|
2 Gbit
|
8 bit
|
1.066 GHz
|
FPGA-78
|
256 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|