- 40 C DRAM

Results: 1.131
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Memory Size Data Bus Width Maximum Clock Frequency Package/Case Organisation Access Time Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Series Packaging
GSI Technology DRAM 32M x 18 (288Meg) LLDRAM II Common I/O Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 18 bit 400 MHz uBGA-144 32 M x 18 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 32M x 18 (288Meg) LLDRAM II Common I/O Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 18 bit 400 MHz uBGA-144 32 M x 18 20 ns 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 533 MHz uBGA-144 16 M x 36 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 400 MHz uBGA-144 16 M x 36 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 400 MHz uBGA-144 16 M x 36 20 ns 1.7 V 1.9 V - 40 C + 95 C Tray
Infineon Technologies S80KS2564GACHA040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 16 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 85 C Tray
Infineon Technologies S80KS2564GACHA043
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 85 C Reel
Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Tray
Infineon Technologies S80KS2564GACHB043
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

HyperRAM 256 Mbit 16 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Reel
Infineon Technologies S80KS2562GABHV020
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 Mbit 8 bit 200 MHz FBGA-24 32 M x 8 35 ns 1.7 V 2 V - 40 C + 105 C Tray
Infineon Technologies S27KL0643GABHV020
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 3.380
Mult.: 3.380

HyperRAM 64 Mbit 8 bit 200 MHz 8 M x 8 35 ns 2.7 V 3.6 V - 40 C + 105 C Tray
Infineon Technologies S70KL1283DPBHV020
Infineon Technologies DRAM SPCM Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 128 Mbit 8 bit 166 MHz 16 M x 8 36 ns 2.7 V 3.6 V - 40 C + 105 C Tray
AP Memory APS12808O-OBR-WB
AP Memory DRAM IoT RAM 128Mb OPI (x8) DDR 200MHz, 1.8V, Ind. Temp., WLCSP Non-Stocked Lead-Time 15 Weeks
Min.: 5.000
Mult.: 5.000
: 5.000

PSRAM (Pseudo SRAM) 128 Mbit 8 bit 200 MHz WLCSP-15 16 M x 8 1.62 V 1.98 V - 40 C + 85 C Reel
AP Memory APS256XXN-OB9-WA
AP Memory DRAM IoT RAM 256Mb OPI (x8,x16) DDR 250MHz, 1.8V, Ind. Temp., WLCSP Non-Stocked Lead-Time 20 Weeks
Min.: 5.000
Mult.: 5.000
: 5.000

PSRAM (Pseudo SRAM) 256 Mbit 8 bit / 16 bit 250 MHz WLCSP-24 32 M x 8/16 M x 16 1.62 V 1.98 V - 40 C + 85 C IoT RAM Reel
AP Memory APS256XXN-OBX9-BG
AP Memory DRAM IoT RAM 256Mb OPI (x8,x16) DDR 250MHz, 1.8V, Ext.. Temp., BGA24 Non-Stocked Lead-Time 20 Weeks
Min.: 4.800
Mult.: 4.800

PSRAM (Pseudo SRAM) 256 Mbit 8 bit / 16 bit 250 MHz BGA-24 32 M x 8/16 M x 16 1.62 V 1.98 V - 40 C + 105 C IoT RAM Tray
ISSI DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

SDRAM 64 Mbit 32 bit 143 MHz BGA-90 2 M x 32 5.5 ns 3 V 3.6 V - 40 C + 105 C IS45S32200L Tray
ISSI DRAM 32Mb, SerialRAM, Continuous Operation, 1.65V-1.95V, 104MHz, 8 pin SOIC 150 mil, RoHS Non-Stocked Lead-Time 12 Weeks
Min.: 3.000
Mult.: 3.000
: 3.000

PSRAM (Pseudo SRAM) 32 Mbit 8 bit 104 MHz SOIC-8 4 M x 8 7 ns 1.65 V 1.95 V - 40 C + 85 C Reel
ISSI DRAM 32Mb, SerialRAM, Continuous Operation, 2.7V-3.6V, 104MHz, 8 pin SOIC 150 mil, RoHS Non-Stocked Lead-Time 12 Weeks
Min.: 3.000
Mult.: 3.000
: 3.000

PSRAM (Pseudo SRAM) 32 Mbit 8 bit 104 MHz SOIC-8 4 M x 8 7 ns 2.7 V 3.6 V - 40 C + 85 C Reel
Alliance Memory DRAM 1G, 1.8V, 128M x 16 DDR2 I Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SDRAM - DDR2 1 Gbit 8 bit 400 MHz FBGA-60 128 M x 8 400 ps 1.7 V 1.9 V - 40 C + 95 C AS4C128M8D2A Reel
Alliance Memory DRAM DDR1, 512Mb, 32M X 16, 2.5V, 60-ball BGA, 200 MHz, Industriall Temp, T&R Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - DDR 512 Mbit 16 bit 200 MHz TFBGA-60 32 M x 16 700 ps 2.3 V 2.7 V - 40 C + 85 C AS4C32M16D1 Reel
Alliance Memory DRAM DDR1, 512Mb, 32M X 16, 2.5V, 66pin TSOP II, 200 MHz, Industrial Temp (A) Tape and Reel Non-Stocked Lead-Time 6 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

SDRAM - DDR 512 Mbit 16 bit 200 MHz TSOP-II-66 32 M x 16 700 ps 2.3 V 2.7 V - 40 C + 85 C AS4C32M16D1A Reel
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 A-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SDRAM - DDR3L 1 Gbit 16 bit 800 MHz FBGA-96 64 M x 16 20 ns 1.283 V 1.45 V - 40 C + 105 C AS4C64M16D3LB Reel
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 I-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SDRAM - DDR3L 1 Gbit 16 bit 800 MHz FBGA-96 64 M x 16 20 ns 1.283 V 1.45 V - 40 C + 95 C AS4C64M16D3LB Reel
Alliance Memory DRAM DDR1, 128Mb, 8M x 16, 2.5V, 66pin TSOP II, 200 MHz, Industriall Temp A Die, T&R Non-Stocked Lead-Time 8 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

SDRAM - DDR 128 Mbit 16 bit 200 MHz TSOP-II-66 8 M x 16 700 ps 2.3 V 2.7 V - 40 C + 85 C AS4C8M16D1A Reel
Alliance Memory DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), INDUSTRIAL TEMP - Tray Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

SDRAM - DDR3L 1 Gbit 16 bit 800 MHz FBGA-96 64 M x 16 20 ns 1.283 V 1.45 V - 40 C + 95 C AS4C64M16D3LB Tray