|
|
DRAM 512Mb 32Mx16 3.3V 143MHz SDRAM I-Temp
- AS4C32M16SC-7TINTR
- Alliance Memory
-
1.000:
Rp303.626
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C3216SC7TINTR
|
Alliance Memory
|
DRAM 512Mb 32Mx16 3.3V 143MHz SDRAM I-Temp
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 1.000
Mult.: 1.000
:
1.000
|
|
|
SDRAM
|
512 Mbit
|
16 bit
|
133 MHz
|
TSOP-II-54
|
32 M x 16
|
17 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
AS4C32M16SC
|
Reel
|
|
|
|
DRAM 512M 3.3V 133MHz 32M x 16 SDRAM
- AS4C32M16SB-6TINTR
- Alliance Memory
-
1:
Rp535.887
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C32M16SB6TINT
|
Alliance Memory
|
DRAM 512M 3.3V 133MHz 32M x 16 SDRAM
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
|
Rp535.887
|
|
|
Rp496.259
|
|
|
Rp480.482
|
|
|
Rp468.740
|
|
|
View
|
|
|
Rp303.626
|
|
|
Rp452.045
|
|
|
Rp440.671
|
|
|
Rp440.304
|
|
|
Rp303.626
|
|
Min.: 1
Mult.: 1
:
1.000
|
|
|
SDRAM
|
512 Mbit
|
16 bit
|
166 MHz
|
TSOP-II-54
|
32 M x 16
|
5 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
AS4C32M16SB
|
Reel, Cut Tape
|
|
|
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Industrial Temp - Tape & Reel
- AS4C64M8D1-5BINTR
- Alliance Memory
-
2.500:
Rp190.615
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D1-5BINT
|
Alliance Memory
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Industrial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM - DDR
|
512 Mbit
|
8 bit
|
200 MHz
|
FBGA-60
|
64 M x 8
|
700 ps
|
2.3 V
|
2.7 V
|
- 40 C
|
+ 85 C
|
AS4C64M8D1
|
Reel
|
|
|
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Industrial Temp - Tape & Reel
- AS4C64M8D2-25BINTR
- Alliance Memory
-
2.000:
Rp232.994
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D225BINT
|
Alliance Memory
|
DRAM DDR2, 512Mb, 64M x 8, 1.8V, 400Mhz, 60-ball FBGA, Industrial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.000
Mult.: 2.000
:
2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
8 bit
|
400 MHz
|
FBGA-60
|
64 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
AS4C64M8D2
|
Reel
|
|
|
|
DRAM 512Mb 64Mx8 3.3V 143MHz SDRAM I-Temp
- AS4C64M8SC-7TINTR
- Alliance Memory
-
1.000:
Rp303.626
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-AS4C64M8SC7TINTR
|
Alliance Memory
|
DRAM 512Mb 64Mx8 3.3V 143MHz SDRAM I-Temp
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1.000
Mult.: 1.000
:
1.000
|
|
|
SDRAM
|
512 Mbit
|
8 bit
|
133 MHz
|
TSOP-II-54
|
64 M x 8
|
17 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
AS4C64M8SC
|
Reel
|
|
|
|
DRAM DDR2, 512Mb, 32M x 16, 1.8V, 84-ball BGA, 400 MHz, Industrial Temp - Tape & Reel
- AS4C32M16D2C-25BINTR
- Alliance Memory
-
2.500:
Rp218.868
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
913-C32M16D2C25BINTR
|
Alliance Memory
|
DRAM DDR2, 512Mb, 32M x 16, 1.8V, 84-ball BGA, 400 MHz, Industrial Temp - Tape & Reel
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
400 MHz
|
FBGA-84
|
32 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
|
Reel
|
|
|
|
DRAM SDR, 256Mb, 16M x 16, 3.3V, 54-ball FBGA, 166 MHz, Industrial Temp(.63) Tape and Reel, B Die
- AS4C16M16SB-6BINTR
- Alliance Memory
-
2.500:
Rp134.109
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
913-S4C16M16SB6BINTR
|
Alliance Memory
|
DRAM SDR, 256Mb, 16M x 16, 3.3V, 54-ball FBGA, 166 MHz, Industrial Temp(.63) Tape and Reel, B Die
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM
|
256 Mbit
|
16 bit
|
166 MHz
|
FBGA-54
|
16 M x 16
|
5 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
Reel
|
|
|
|
DRAM SDR, 256Mb, 16M x 16, 3.3V, 54pin TSOP II, 166 Mhz, industrial temp(.63) Tape and Reel, B Die
- AS4C16M16SB-6TINTR
- Alliance Memory
-
1:
Rp250.056
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
913-S4C16M16SB6TINTR
|
Alliance Memory
|
DRAM SDR, 256Mb, 16M x 16, 3.3V, 54pin TSOP II, 166 Mhz, industrial temp(.63) Tape and Reel, B Die
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp250.056
|
|
|
Rp232.260
|
|
|
Rp225.105
|
|
|
Rp214.648
|
|
|
View
|
|
|
Rp134.109
|
|
|
Rp209.328
|
|
|
Rp206.209
|
|
|
Rp201.072
|
|
|
Rp134.109
|
|
Min.: 1
Mult.: 1
:
1.000
|
|
|
SDRAM
|
256 Mbit
|
16 bit
|
166 MHz
|
TSOP-II-54
|
16 M x 16
|
5 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
Reel, Cut Tape
|
|
|
|
DRAM SDR, 512Mb, 32M x 16, 3.3V, 54-ball FBGA, 143MHz, Industrial Temp, B Die,T&R
- AS4C32M16SB-7BINTR
- Alliance Memory
-
2.500:
Rp303.626
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-S4C32M16SB7BINTR
|
Alliance Memory
|
DRAM SDR, 512Mb, 32M x 16, 3.3V, 54-ball FBGA, 143MHz, Industrial Temp, B Die,T&R
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 2.500
Mult.: 2.500
:
2.500
|
|
|
SDRAM
|
512 Mbit
|
16 bit
|
143 MHz
|
FBGA-54
|
32 M x 16
|
5.4 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
Reel
|
|
|
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
- A3R12E40DBF-8EA
- Zentel Japan
-
2.000:
Rp182.176
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R12E40DBF-8EA
|
Zentel Japan
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
400 MHz
|
FPGA-84
|
32 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 105 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
- A3R12E40DBF-8EI
- Zentel Japan
-
2.000:
Rp148.786
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R12E40DBF-8EI
|
Zentel Japan
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
400 MHz
|
FPGA-84
|
32 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
- A3R1GE40JBF-8EA
- Zentel Japan
-
2.000:
Rp244.919
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R1GE40JBF-8EA
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
400 MHz
|
FPGA-84
|
64 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 105 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
- A3R1GE40JBF-8EI
- Zentel Japan
-
2.000:
Rp202.356
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R1GE40JBF-8EI
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
400 MHz
|
FPGA-84
|
64 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
- A3S12D40GTP-50I
- Zentel Japan
-
1.080:
Rp197.220
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3S12D40GTP-50I
|
Zentel Japan
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 1.080
Mult.: 1.080
|
|
|
SDRAM - DDR
|
512 Mbit
|
16 bit
|
200 MHz
|
TSOP-II-66
|
32 M x 16
|
700 ps
|
2.3 V
|
2.7 V
|
- 40 C
|
+ 85 C
|
DDR1
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
- A3T1GF30CBF-GMI
- Zentel Japan
-
2.200:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GMI
|
Zentel Japan
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78, Ind. Temp.
- A3T1GF30CBF-GMLI
- Zentel Japan
-
2.200:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GMLI
|
Zentel Japan
|
DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3L
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 64Mx16, 1600 at CL11, 1.5V, FBGA-96, Ind. Temp.
- A3T1GF40CBF-GMI
- Zentel Japan
-
1.900:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF40CBF-GMI
|
Zentel Japan
|
DRAM DDR3 1Gb, 64Mx16, 1600 at CL11, 1.5V, FBGA-96, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 1.900
Mult.: 1.900
|
|
|
SDRAM - DDR3
|
1 Gbit
|
16 bit
|
800 MHz
|
FPGA-96
|
64 M x 16
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3L 1Gb, 64Mx16, 1600 at CL11, 1.35V, FBGA-96, Ind. Temp.
- A3T1GF40CBF-GMLI
- Zentel Japan
-
1.900:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF40CBF-GMLI
|
Zentel Japan
|
DRAM DDR3L 1Gb, 64Mx16, 1600 at CL11, 1.35V, FBGA-96, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 1.900
Mult.: 1.900
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
16 bit
|
800 MHz
|
FPGA-96
|
64 M x 16
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3L
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 64Mx16, 1866 at CL13, 1.5V, FBGA-96, Ind. Temp.
- A3T1GF40CBF-HPI
- Zentel Japan
-
1.900:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF40CBF-HPI
|
Zentel Japan
|
DRAM DDR3 1Gb, 64Mx16, 1866 at CL13, 1.5V, FBGA-96, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 1.900
Mult.: 1.900
|
|
|
SDRAM - DDR3
|
1 Gbit
|
16 bit
|
933 MHz
|
FPGA-96
|
64 M x 16
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
- A3T2GF30CBF-HPI
- Zentel Japan
-
2.420:
Rp372.791
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T2GF30CBF-HPI
|
Zentel Japan
|
DRAM DDR3&DDR3L 2Gb, 256Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3L
|
2 Gbit
|
8 bit
|
933 MHz
|
FPGA-78
|
256 M x 8
|
|
1.283 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3(L)
|
Tray
|
|
|
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
- A3T2GF30CBF-JRI
- Zentel Japan
-
2.420:
Rp385.266
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3T2GF30CBF-JRI
|
Zentel Japan
|
DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3
|
2 Gbit
|
8 bit
|
1.066 GHz
|
FPGA-78
|
256 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
- A3T2GF40CBF-JRI
- Zentel Japan
-
2.090:
Rp385.266
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3T2GF40CBF-JRI
|
Zentel Japan
|
DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 2.090
Mult.: 2.090
|
|
|
SDRAM - DDR3
|
2 Gbit
|
16 bit
|
1.066 GHz
|
FPGA-96
|
128 M x 16
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
- A3T4GF30BBF-HPI
- Zentel Japan
-
2.420:
Rp572.395
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T4GF30BBF-HPI
|
Zentel Japan
|
DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3L
|
4 Gbit
|
8 bit
|
933 MHz
|
FPGA-78
|
512 M x 8
|
|
1.283 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3(L)
|
Tray
|
|
|
|
DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
- A3T4GF30BBF-JRI
- Zentel Japan
-
2.420:
Rp572.395
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3T4GF30BBF-JRI
|
Zentel Japan
|
DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR3
|
4 Gbit
|
8 bit
|
1.066 GHz
|
FPGA-78
|
512 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp.
- A3T4GF40BBF-HPI
- Zentel Japan
-
2.090:
Rp572.395
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T4GF40BBF-HPI
|
Zentel Japan
|
DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp.
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Non-Stocked Lead-Time 20 Weeks
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Min.: 2.090
Mult.: 2.090
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SDRAM - DDR3L
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4 Gbit
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16 bit
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933 MHz
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FPGA-96
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256 M x 16
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1.283 V
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1.575 V
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- 40 C
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+ 95 C
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DDR3(L)
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Tray
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