|
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 933MHz
Winbond W638GU6RB-11
- W638GU6RB-11
- Winbond
-
480:
Rp989.400
-
Non-Stocked Lead-Time 36 Weeks
-
NRND
|
Mouser Part No
454-W638GU6RB-11
NRND
|
Winbond
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 933MHz
|
|
Non-Stocked Lead-Time 36 Weeks
|
|
Min.: 480
Mult.: 480
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
|
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 1066MHz, Industrial Temp
Winbond W638GU6RB09I
- W638GU6RB09I
- Winbond
-
480:
Rp989.400
-
Non-Stocked Lead-Time 36 Weeks
-
NRND
|
Mouser Part No
454-W638GU6RB09I
NRND
|
Winbond
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 1066MHz, Industrial Temp
|
|
Non-Stocked Lead-Time 36 Weeks
|
|
Min.: 480
Mult.: 480
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
|
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 933MHz, Industrial Temp
Winbond W638GU6RB11I
- W638GU6RB11I
- Winbond
-
480:
Rp989.400
-
Non-Stocked Lead-Time 36 Weeks
-
NRND
|
Mouser Part No
454-W638GU6RB11I
NRND
|
Winbond
|
DRAM 8Gb DDR3L 1.35V SDRAM, x16, 933MHz, Industrial Temp
|
|
Non-Stocked Lead-Time 36 Weeks
|
|
Min.: 480
Mult.: 480
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
|
|
DRAM DDR2, 2G, 128M x 16, 1.8V, 400Mhz, 84ball FBGA, (A-die), Commercial Temp - Tray
- AS4C128M16D2A-25BCN
- Alliance Memory
-
1:
Rp805.022
-
Lead-Time 12 Weeks
|
Mouser Part No
913-4C128M16D2A25BCN
|
Alliance Memory
|
DRAM DDR2, 2G, 128M x 16, 1.8V, 400Mhz, 84ball FBGA, (A-die), Commercial Temp - Tray
|
|
Lead-Time 12 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR2
|
2 Gbit
|
16 bit
|
400 MHz
|
FBGA-84
|
128 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
AS4C128M16D2A-25
|
Tray
|
|
|
|
DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), AUTOMOTIVE TEMP - Tray
- AS4C64M16D3LB-12BAN
- Alliance Memory
-
1:
Rp914.365
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-A4C6416D3LB12BAN
|
Alliance Memory
|
DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), AUTOMOTIVE TEMP - Tray
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
16 bit
|
800 MHz
|
FBGA-96
|
64 M x 16
|
20 ns
|
1.283 V
|
1.45 V
|
- 40 C
|
+ 105 C
|
AS4C64M16D3LB
|
Tray
|
|
|
|
DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), INDUSTRIAL TEMP - Tray
- AS4C64M16D3LB-12BIN
- Alliance Memory
-
1:
Rp593.860
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
913-A4C6416D3LB12BIN
|
Alliance Memory
|
DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), INDUSTRIAL TEMP - Tray
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR3L
|
1 Gbit
|
16 bit
|
800 MHz
|
FBGA-96
|
64 M x 16
|
20 ns
|
1.283 V
|
1.45 V
|
- 40 C
|
+ 95 C
|
AS4C64M16D3LB
|
Tray
|
|
|
|
DRAM DDR1, 512Mb, 32M X 16, 2.5V, 60-ball BGA, 200 MHz, Commercial Temp - Tray
- AS4C32M16D1-5BCN
- Alliance Memory
-
240:
Rp327.109
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C32M16D1-5BCN
|
Alliance Memory
|
DRAM DDR1, 512Mb, 32M X 16, 2.5V, 60-ball BGA, 200 MHz, Commercial Temp - Tray
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 240
Mult.: 240
|
|
|
SDRAM - DDR
|
512 Mbit
|
16 bit
|
200 MHz
|
TFBGA-60
|
32 M x 16
|
700 ps
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
AS4C32M16D1
|
Tray
|
|
|
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tray
- AS4C64M8D1-5BCN
- Alliance Memory
-
240:
Rp284.730
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
913-AS4C64M8D1-5BCN
|
Alliance Memory
|
DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tray
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 240
Mult.: 240
|
|
|
SDRAM - DDR
|
512 Mbit
|
8 bit
|
200 MHz
|
FBGA-60
|
64 M x 8
|
700 ps
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
AS4C64M8D1
|
Tray
|
|
|
|
DRAM
AP Memory NRE-TI-RDL- APS6404L-SQHXRQ
- NRE-TI-RDL- APS6404L-SQHXRQ
- AP Memory
-
1:
Rp337.699.959
-
Non-Stocked
-
Factory Special Order
|
Mouser Part No
878-NRETIRDLAPS6404L
Factory Special Order
|
AP Memory
|
DRAM
|
|
Non-Stocked
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Bulk
|
|
|
|
DRAM 256M, 3.3V, SDRAM, 16Mx16, 143MHz, 54 pin TSOP II RoHS, IT
- IS42S16160G-7TLI
- ISSI
-
1:
Rp177.956
-
Lead-Time 6 Weeks
-
NRND
|
Mouser Part No
870-IS42S16160G-7TLI
NRND
|
ISSI
|
DRAM 256M, 3.3V, SDRAM, 16Mx16, 143MHz, 54 pin TSOP II RoHS, IT
|
|
Lead-Time 6 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM
|
256 Mbit
|
16 bit
|
143 MHz
|
TSOP-II-54
|
16 M x 16
|
5.5 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
IS42S16160G
|
Tray
|
|
|
|
DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM
- IS45S32200L-7BLA2
- ISSI
-
240:
Rp184.928
-
Non-Stocked Lead-Time 10 Weeks
-
NRND
|
Mouser Part No
870-IS45S32200L7BLA2
NRND
|
ISSI
|
DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
Min.: 240
Mult.: 240
|
|
|
SDRAM
|
64 Mbit
|
32 bit
|
143 MHz
|
BGA-90
|
2 M x 32
|
5.5 ns
|
3 V
|
3.6 V
|
- 40 C
|
+ 105 C
|
IS45S32200L
|
Tray
|
|
|
|
DRAM DDR4 4Gb, 256Mx16, 3200 CL22, 1.2V, FBGA-96
- A3F4GH40DBF-WC
- Zentel Japan
-
1:
Rp795.299
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3F4GH40DBF-WC
|
Zentel Japan
|
DRAM DDR4 4Gb, 256Mx16, 3200 CL22, 1.2V, FBGA-96
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR4
|
4 Gbit
|
16 bit
|
3.2 GHz
|
FBGA-96
|
256 M x 16
|
|
1.14 V
|
1.26 V
|
0 C
|
+ 95 C
|
DDR4
|
Tray
|
|
|
|
DRAM DDR4 8Gb, 512Mx16, 2666 at CL19, 1.2V, FBGA-96
- A3F8GH40BBF-KD
- Zentel Japan
-
2.090:
Rp1.237.254
-
Non-Stocked Lead-Time 28 Weeks
|
Mouser Part No
155-A3F8GH40BBF-KD
|
Zentel Japan
|
DRAM DDR4 8Gb, 512Mx16, 2666 at CL19, 1.2V, FBGA-96
|
|
Non-Stocked Lead-Time 28 Weeks
|
|
Min.: 2.090
Mult.: 2.090
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
|
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
- A3R12E40DBF-8EA
- Zentel Japan
-
2.000:
Rp182.176
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R12E40DBF-8EA
|
Zentel Japan
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
400 MHz
|
FPGA-84
|
32 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 105 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
- A3R12E40DBF-8EI
- Zentel Japan
-
2.000:
Rp148.786
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R12E40DBF-8EI
|
Zentel Japan
|
DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
400 MHz
|
FPGA-84
|
32 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 512Mb, 32Mx16, 1066 at CL7, 1.8V, FBGA-84
- A3R12E40DBF-AH
- Zentel Japan
-
2.000:
Rp115.396
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3R12E40DBF-AH
|
Zentel Japan
|
DRAM DDR2 512Mb, 32Mx16, 1066 at CL7, 1.8V, FBGA-84
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
512 Mbit
|
16 bit
|
533 MHz
|
FPGA-84
|
32 M x 16
|
350 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 128Mx8, 800 at CL5, 1.8V, FBGA-60
- A3R1GE30JBF-8E
- Zentel Japan
-
2.420:
Rp156.308
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3R1GE30JBF-8E
|
Zentel Japan
|
DRAM DDR2 1Gb, 128Mx8, 800 at CL5, 1.8V, FBGA-60
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.420
Mult.: 2.420
|
|
|
SDRAM - DDR2
|
1 Gbit
|
8 bit
|
400 MHz
|
FPGA-60
|
128 M x 8
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84
- A3R1GE40JBF-8E
- Zentel Japan
-
2.000:
Rp156.308
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3R1GE40JBF-8E
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
400 MHz
|
FPGA-84
|
64 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
- A3R1GE40JBF-8EA
- Zentel Japan
-
2.000:
Rp244.919
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R1GE40JBF-8EA
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
400 MHz
|
FPGA-84
|
64 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 105 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
- A3R1GE40JBF-8EI
- Zentel Japan
-
2.000:
Rp202.356
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3R1GE40JBF-8EI
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
400 MHz
|
FPGA-84
|
64 M x 16
|
400 ps
|
1.7 V
|
1.9 V
|
- 40 C
|
+ 95 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR2 1Gb, 64Mx16, 1066 at CL7, 1.8V, FBGA-84
- A3R1GE40JBF-AH
- Zentel Japan
-
2.000:
Rp156.308
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3R1GE40JBF-AH
|
Zentel Japan
|
DRAM DDR2 1Gb, 64Mx16, 1066 at CL7, 1.8V, FBGA-84
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
SDRAM - DDR2
|
1 Gbit
|
16 bit
|
533 MHz
|
FPGA-84
|
64 M x 16
|
350 ps
|
1.7 V
|
1.9 V
|
0 C
|
+ 85 C
|
DDR2
|
Tray
|
|
|
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66
- A3S12D40GTP-50
- Zentel Japan
-
1:
Rp193.000
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3S12D40GTP-50
|
Zentel Japan
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
SDRAM - DDR
|
512 Mbit
|
16 bit
|
200 MHz
|
TSOP-II-66
|
32 M x 16
|
700 ps
|
2.3 V
|
2.7 V
|
0 C
|
+ 70 C
|
DDR1
|
Tray
|
|
|
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
- A3S12D40GTP-50I
- Zentel Japan
-
1.080:
Rp197.220
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3S12D40GTP-50I
|
Zentel Japan
|
DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 1.080
Mult.: 1.080
|
|
|
SDRAM - DDR
|
512 Mbit
|
16 bit
|
200 MHz
|
TSOP-II-66
|
32 M x 16
|
700 ps
|
2.3 V
|
2.7 V
|
- 40 C
|
+ 85 C
|
DDR1
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78
- A3T1GF30CBF-GM
- Zentel Japan
-
2.200:
Rp194.468
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GM
|
Zentel Japan
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
0 C
|
+ 95 C
|
DDR3
|
Tray
|
|
|
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
- A3T1GF30CBF-GMI
- Zentel Japan
-
2.200:
Rp248.772
-
Non-Stocked Lead-Time 20 Weeks
|
Mouser Part No
155-A3T1GF30CBF-GMI
|
Zentel Japan
|
DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp.
|
|
Non-Stocked Lead-Time 20 Weeks
|
|
Min.: 2.200
Mult.: 2.200
|
|
|
SDRAM - DDR3
|
1 Gbit
|
8 bit
|
800 MHz
|
FPGA-78
|
128 M x 8
|
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 95 C
|
DDR3
|
Tray
|
|