|
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray
- ASFC64G31T5-51BIN
- Alliance Memory
-
1:
Rp3.981.815,84
-
456On Order
|
Mouser Part No
913-ASFC64G31T551BIN
|
Alliance Memory
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray
|
|
456On Order
On Order:
152 Expected 21/01/2027
304 Expected 06/08/2027
Factory Lead Time:
52 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
|
FBGA-153
|
64 GB
|
TLC
|
301 MB/s
|
222 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC eMMC, 128GB, 5.1, 3V, TLC Gen5 NAND Dual Die, Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die, Tray
- ASFC128G32T5A-51BIN
- Alliance Memory
-
1:
Rp5.769.266,62
-
304Expected 28/01/2027
-
New Product
|
Mouser Part No
913-FC128G32T5A51BIN
New Product
|
Alliance Memory
|
eMMC eMMC, 128GB, 5.1, 3V, TLC Gen5 NAND Dual Die, Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die, Tray
|
|
304Expected 28/01/2027
|
|
Min.: 1
Mult.: 1
|
|
|
|
FBGA-153
|
128 GB
|
TLC
|
|
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC eMMC, 256GB, 5.1, 3V, TLC Gen5 NAND Quad Die , Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die, Tray
- ASFC256G34T5A-51BIN
- Alliance Memory
-
1:
Rp12.917.051,68
-
152Expected 28/01/2027
-
New Product
|
Mouser Part No
913-FC256G34T5A51BIN
New Product
|
Alliance Memory
|
eMMC eMMC, 256GB, 5.1, 3V, TLC Gen5 NAND Quad Die , Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die, Tray
|
|
152Expected 28/01/2027
|
|
Min.: 1
Mult.: 1
|
|
|
|
FBGA-153
|
256 GB
|
TLC
|
|
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC eMMC, 64GB, 5.1, 3V, TLC Gen5 NAND, Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die
- ASFC64G31T5A-51BIN
- Alliance Memory
-
1:
Rp3.981.815,84
-
304Expected 28/01/2027
-
New Product
|
Mouser Part No
913-SFC64G31T5A51BIN
New Product
|
Alliance Memory
|
eMMC eMMC, 64GB, 5.1, 3V, TLC Gen5 NAND, Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , A die
|
|
304Expected 28/01/2027
|
|
Min.: 1
Mult.: 1
|
|
|
|
FBGA-153
|
64 GB
|
TLC
|
|
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC ATP TLC eMMC V5.1 153b C-Temp 32GB
- AF032GEC5X-2002CX
- ATP Electronics
-
760:
Rp287.848,74
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-032GEC5X-2002CX
|
ATP Electronics
|
eMMC ATP TLC eMMC V5.1 153b C-Temp 32GB
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
32 GB
|
TLC
|
|
|
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
- AF032GEC5X-2002IX
- ATP Electronics
-
760:
Rp407.281,20
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-032GEC5X-2002IX
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E600Si
|
FBGA-153
|
32 GB
|
TLC
|
290 MB/s
|
220 MB/s
|
eMMC 5.1 HS400
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF032GEC5X-2006CX
- ATP Electronics
-
1.050:
Rp296.838,28
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-AF032GEC5X2006CX
New Product
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
32 GB
|
TLC
|
250 MB/s
|
135 MB/s
|
eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF032GEC5X-2006IX
- ATP Electronics
-
1.050:
Rp300.140,56
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-AF032GEC5X2006IX
New Product
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
32 GB
|
TLC
|
|
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006CX
- ATP Electronics
-
1.050:
Rp707.238,30
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006CX
New Product
|
ATP Electronics
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
290 MB/s
|
225 MB/s
|
eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006IX
- ATP Electronics
-
1.050:
Rp722.098,56
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006IX
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
|
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC128G32T5-51BINTR
- Alliance Memory
-
1.500:
Rp4.982.039,76
-
Non-Stocked Lead-Time 30 Weeks
|
Mouser Part No
913-C128G32T551BINTR
|
Alliance Memory
|
eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 30 Weeks
|
|
Min.: 1.500
Mult.: 1.500
:
1.500
|
|
|
|
FBGA-153
|
128 GB
|
TLC
|
320 MB/s
|
235 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC64G31T5-51BINTR
- Alliance Memory
-
1.500:
Rp2.825.284,00
-
Non-Stocked Lead-Time 30 Weeks
|
Mouser Part No
913-FC64G31T551BINTR
|
Alliance Memory
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 30 Weeks
|
|
Min.: 1.500
Mult.: 1.500
:
1.500
|
|
|
|
FBGA-153
|
64 GB
|
TLC
|
301 MB/s
|
222 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|