ARM Cortex A53 Core Multiprotocol Modules

Results: 5
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Frequency Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - WiFi - 802.11 Product Packaging
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

900 MHz, 1.8 GHz, 2.4 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, PWM, SPI, UART, USB 2.0, VGA 3.5 V 4.2 V - 30 C + 75 C 35 mm x 31 mm x 2.65 mm Bluetooth 2.1 + EDR, Bluetooth 4.2 LTE Cat 4 BDS, GLONASS, GPS 802.11 b/g/n 802.11 b/g/n, Bluetooth 2.1 + EDR, Bluetooth 4.2, BDS, GLONASS, GPS
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel Multiprotocol Modules SC200E with eMCP memory(EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 Reel
Quectel Multiprotocol Modules Longevity till 2030, Linux version (EAU >2000pcs) Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4 Reel