- 40 C Tray Multiprotocol Modules

Results: 96
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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silicon Labs Multiprotocol Modules MGM13S02F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz 19 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C 6.5 mm x 6.5 mm x 1.4 mm Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules Non-Stocked
Min.: 420
Mult.: 420
2.402 GHz to 2.48 GHz 20 dBm 1.85 V 3.6 V - 40 C + 85 C Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules Non-Stocked
Min.: 1
Mult.: 1
2.402 GHz to 2.48 GHz 20 dBm 1.85 V 3.6 V - 40 C + 85 C Tray
Silicon Labs Multiprotocol Modules RS9116 Single Band Wi-Fi NCP Module
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

2.412 GHz SPI, UART, USB 1.75 V 3.63 V - 40 C + 85 C Tray
NXP Semiconductors Multiprotocol Modules IW610FHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.300
Mult.: 1.300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.300
Mult.: 1.300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
Telit Cinterion Multiprotocol Modules WE310G4-I (Wi-Fi a/b/g/n+BLE) 47.00.003
Datasheet
Non-Stocked
Min.: 392
Mult.: 392
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Telit Cinterion Multiprotocol Modules WE310G4-P (Wi-Fi a/b/g/n+BLE) 47.00.003
Datasheet
Non-Stocked
Min.: 720
Mult.: 720
5 GHz 8 dBm, 18 dBm, 19 dBm I2C, SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Telit Cinterion Multiprotocol Modules Non-Stocked
Min.: 1
Mult.: 1

2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm WiFi-802.11 b/g/n Tray
Telit Cinterion Multiprotocol Modules Non-Stocked
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz SPI, UART, USB - 40 C + 85 C WiFi 802.11 a/b/g/n Tray
Silicon Labs Multiprotocol Modules 1band nlink Wifi BT4.0 zigbee
Datasheet
Non-Stocked
Min.: 490
Mult.: 490

RS9113 2.4 GHz 17 dBm SDIO, USB 3 V 3.6 V - 40 C + 85 C u.FL 15 mm x 14 mm x 2.1 mm Bluetooth 4.0 Cellular 802.11 a/b/g/n ANT, Thread Tray
Silicon Labs Multiprotocol Modules RS9116 n-Link and WiSeConnect Wi-Fi and Dual-Mode Bluetooth 5 Wireless Connectivity CC0 Module
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 18 dBm SPI 3 V 3.63 V - 40 C + 85 C 9.8 mm x 9.1 mm x 1.6 mm Tray
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEBE-M2 is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset.
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz Bluetooth, USB, UART 3.3 V - 40 C + 85 C MHF4 Tray
Quectel Multiprotocol Modules Wi-Fi 5 & Bluetooth 5.0, dual band 2.4/5GHz, 1x1 antenna, -40C to +85 C, M.2 FF Non-Stocked
Min.: 250
Mult.: 250

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Quectel Multiprotocol Modules Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C, M.2 FF
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 200
Mult.: 200
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 40 C + 85 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel Multiprotocol Modules
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 2 W ADC, Audio, Bluetooth PCM, UART 3.3 V 4.6 V - 40 C + 85 C Pad 17.7 mm x 15.8 mm x 2.3 mm Bluetooth 3.0 GSM/GPRS Tray