- 40 C Multiprotocol Modules

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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Qualification
Packaging
Quectel Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
Datasheet
100Expected 11/09/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules NXP platform, SDIO Interface
Datasheet
100Expected 04/12/2026
Min.: 1
Mult.: 1
: 1.000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
100Expected 28/08/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Telink Multiprotocol Modules The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee
DFRobot Multiprotocol Modules Gravity: CAT1 SIM7600G Global 4G Communication and GNSS Positioning Module (10Mbps/5Mbps) Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

1.9 GHz 5 V 12 V - 40 C + 85 C 60 mm x 52 mm GPS, BD, GLONASS Bulk
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Embedded Artists Multiprotocol Modules 2DL M.2 Module Non-Stocked Lead-Time 3 Weeks
Min.: 1.000
Mult.: 1

2.4 GHz to 5 GHz SPI 3 V 3.6 V - 40 C + 85 C Bulk
Ezurio Multiprotocol Modules BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Cut Tape
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Cut Tape
Ezurio Multiprotocol Modules Module, Sterling-EWB, SIP, Tape & Reel
Datasheet
Non-Stocked
Min.: 2.000
Mult.: 2.000
: 2.000

Sterling-EWB 2.4 GHz, 5 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 10 mm Bluetooth 5.1 802.11 b/g/n Reel
Ezurio Multiprotocol Modules Module, Sterling-EWB, U.FL, Tape & Reel
Datasheet
Non-Stocked
Min.: 1.000
Mult.: 1.000
: 1.000

Sterling-EWB 2.4 GHz, 5 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL 16 mm x 21 mm Bluetooth 5.1 802.11 b/g/n Reel
Ezurio Multiprotocol Modules Module, Sterling-EWB, Chip Antenna, Tape & Reel
Datasheet
Non-Stocked
Min.: 1.000
Mult.: 1.000
: 1.000

Sterling-EWB 2.4 GHz, 5 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 16 mm x 21 mm Bluetooth 5.1 802.11 b/g/n Reel
Ezurio Multiprotocol Modules Module, BL54L15, Bluetooth LE, MHF4, Cut Tape
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
BL54L15 2.402 GHz to 2.48 GHz UART 1.7 V 3.6 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotocol Modules Module, Sterling LWB5+, Trace Pin
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

Sterling-LWB5+ 2.4 GHz, 5 GHz UART, USB 3.3 V 3.3 V - 40 C + 85 C 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Reel
Ezurio Multiprotocol Modules SIP, Sterling LWB+, Tape and Reel
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 12 mm x 12 mm x 3 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel
Ezurio Multiprotocol Modules Sterling LWB+, Chip Antenna, Tape and Reel
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape