-ar Multiprotocol Modules

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Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Quectel Multiprotocol Modules Wi-Fi /BT variant. 1+8GB - Consumer temperature range(EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules cloud enabled, Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel
Quectel Multiprotocol Modules Longevity till 2030, Linux version (EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Reel
Quectel Multiprotocol Modules SC200E with eMCP memory(EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel
Quectel Multiprotocol Modules No connectivity. 4+32GB - Industrial temperature range(EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash Non-Stocked
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), support VoLTE
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel Multiprotocol Modules cloud enabled, Cat M1/Cat NB2, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency)
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250
21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency)
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2 - QuecOpen + GNSS (w/o WWAN concurrency)
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 500
Mult.: 500
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GNSS Reel
Quectel Multiprotocol Modules cloud enabled, Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY!
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C RF Connector 25.5 mm x 18 mm x 3.16 mm 802.11a/b/g/n/ac/ax Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS, LTE-FDD B31/ 72/ 73 supports Pwr Class 2 (26 dBm) while other LTE bands supports Pwrr Class 5 (21 dBm)
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel Multiprotocol Modules Cat M1/Cat NB2, 410 MHz at Pwr Class 3 & 450 MHz at Pwr Class 2 (26dBm) + GNSS
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz I2C, SPI 3.14 V 3.46 V - 40 C + 85 C 25.5 mm × 18 mm × 3.16 mm Reel
Quectel FCM362KAAMD-1X-04
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna: IPEX-1, 4MB Flash Non-Stocked Lead-Time 8 Weeks
Min.: 500
Mult.: 250
: 250
2.4 GHz, 5 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 25.5 mm x 18 mm x 3.15 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel FCM362KAATB-0P-04
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz UART 3 V 3.6 V - 40 C + 85 C 25.5 mm x 18 mm x 3.15 mm BLE 5.2 802.11 a/b/g/n/ac/ax
Quectel FCM362KAAMD-0L-04
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), 1 1 Antenna: LCC, 4MB Flash Non-Stocked Lead-Time 8 Weeks
Min.: 500
Mult.: 250
: 250
2.4 GHz, 5 GHz UART 3 V 3.6 V - 40 C + 85 C 25.5 mm x 18 mm x 3.15 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel