Grinn GenioSOM-510 System-on-Module

Grinn GenioSOM-510 System-on-Module (SoM) is an advanced, high‑performance device engineered for modern Artificial Intelligence (AI), multimedia, and Internet of Things (IoT) applications. Built around the powerful MediaTek MT8370 processor, Grinn GenioSOM-510 combines a dual‑core Arm^® Cortex^®‑A78 and quad‑core Arm Cortex‑A55 CPU cluster to deliver strong compute performance while maintaining energy efficiency. The module integrates a single‑core Cadence HiFi 5 DSP, a 32‑bit MDSP RV55 System Companion Processor, and a Cadence^® Tensilica^® VP6 AI Processor Unit, enabling real‑time audio processing, system management, and hardware‑accelerated AI workloads. To support demanding graphics and vision tasks, the GenioSOM‑510 includes an Arm Mali™‑G57 MC2 GPU with modern API support such as Vulkan^® 1.1, OpenGL ES 3.2, and OpenCL™ 2.2, along with an image pipeline capable of handling 32MP single‑camera or dual 16MP capture at 30fps. The SoM also provides comprehensive multimedia capabilities with 4K video encoding at 30fps and 4K decoding at 60fps, supporting formats including AV1, VP9, HEVC, H.264, and others.

The module is designed with flexibility in mind, featuring options for 16GB eMMC storage (expandable up to 64GB) and 2x 2GB LPDDR4 RAM (with optional 2x 4GB configurations). The device offers a wide set of high‑speed interfaces (USB 3.1, USB 2.0, PCIe, eDP/DP, HDMI, CSI, DSI, SPI, UART, I²C, I²S, DMIC, RGMII Ethernet, and up to 143 GPIOs), making it adaptable for a vast range of embedded designs. With support for FHD60 and 4K60 displays, the module excels in applications requiring rich visual output, from smart home devices to industrial Human-Machine Interfaces (HMIs) and multimedia streaming systems.

Engineered for robust, real‑world deployments, the Grinn GenioSOM‑510 targets AI‑enabled computer vision, advanced IoT systems, smart home appliances, industrial automation, and high‑quality audio/video processing. The compact LGA312 package simplifies integration into custom hardware, while the combination of compute power, AI acceleration, multimedia capability, and broad I/O support positions the SoM as a versatile foundation for next‑generation embedded products.

Features

Built around the MediaTek MT8370 processor
LGA312 package
Simple design of the end device
Dual-core Arm Cortex-A78
Quad-core Arm Cortex-A55
Single-core Cadence HiFi 5 Audio Engine DSP with up to 800MHz
System Companion Processor (SCP) 32-bit MDSP RV55 microprocessor with up to 800MHz
16GB eMMC memory (optional up to 64GB)
2x 2GB LPDDR4 RAM (optional 2x 4GB)
Arm Mali-G57 MC2 3D graphics accelerator (GPU) with Vulkan 1.1, OpenGL ES 3.2, and OpenCL 2.2
Single-core AI Processor Unit (APU) Cadence Tensilica VP6 processor with AI Accelerator (AIA)
Display output supporting FHD60 + 4K60 resolution
Image processing
- 32MP at 30fps for single camera capture
- 16MP + 16MP at 30fps for dual camera capture
4K video encoding at 30fps with HEVC/H.264
4K video decoding at 60fps with AV1/VP9/HEVC/H.264
HEVC
- Main profile 4K2K at 60fps/160Mbps, 8-bits
- Main 10 profile 4K2K at 60fps/160Mbps, 10-bits

HEIF
- Main profile 16383 x 16383 maximum resolution, 8-bits
- Main 10 profile 16383 x 16383 maximum resolution, 10-bits
VP9
- Profile 0 4K2K at 60fps/120Mbps, 8-bits
- Profile 2 4K2K at 60fps/120Mbps, 10-bits
AV1 - main profile 0 4K2K at 60fps/120Mbps, 8-/10-bits
AVC
- Constrained baseline 4K2K at 60fps/160Mbps, 8-bits
- Main/high profile 4K2K at 60fps/160Mbps, 8-bits
- High 10 profile 4K2K at 60fps/160Mbps, 10-bits
MPEG-4
- Simple profile 1080p at 60fps/60Mbps, 8-bits
- Advanced simple profile 1080p at 60fps/60Mbps, 8-bits
MPEG-2 - main profile 1080p at 60fps/60Mbps, 8-bits
VP8 - 1080p at 60fps/40Mbps, 8-bits
H.263 - baseline profile 1080p at 60fps/60Mbps
2x USB2.0, 1x USB3.1, 1x PCIE, 1x eDP, 1x DP, 6x SPI, 4x UART, 1x AUX, 2x MSDC, 7x I²C (up to 2x I3S included), 2x I²S, 1x PCM, 2x DMIC, 4x CSI, 2x DSI, 1x DPI, 1x HDMI, 4x PWM, and 1x RGMII
Up to 143 GPIOs