Infineon Technologies Residential Heat Pump Solutions

CIPOS™ IPMs and Easy Modules are optimal solutions for highly integrated compressor drives, while discrete solutions are ideal when layout flexibility and thermal performance optimization are major factors. The combination with iMOTION™ products is possible for dedicated motor control.

The merge of PSoC™ microcontrollers for system control, XENSIV™ sensors, and AIROC™ Wi-Fi® and BLUETOOTH© combo products enable highly innovative and easy-to-design systems with a rich user interface.

Included in Infineon's power portfolio are CoolSET™ rounds for the auxiliary power supply, offering increased robustness and performance. Additionally, EiceDRIVER™ gate driver ICs provide a comprehensive product portfolio with various configurations, voltage classes, protection features, and isolation levels, ensuring they apply to a broad range of power switches.

• XENSIV™ Sensors
Predictive maintenance enables a data-driven approach to predict and prevent device failures based on pattern recognition and intelligent software models. To collect the necessary data and enable monitoring of the condition of devices in a building, smart XENSIV sensors help to record the most crucial parameters of a device's status.

• AIROC™ Wi-Fi and Combos
AIROC Wi-Fi and Combos integrate IEEE 802.11a/b/g/n/ac WLAN and Bluetooth in a single-chip solution to enable small-form-factor IoT designs. Combo solutions are available for 1x1 SISO with up to 433Mbps PHY data rates and 2x2 MIMO with up to 867Mbps PHY data rates. These solutions can be coupled with external MCUs or Linux on applications processors to implement a complete Wi-Fi + Bluetooth system.

• OPTIGA™ Trust
Responding to a growing focus on embedded systems among attackers, Infineon offers OPTIGA Trust hardware security solutions based on a high-end security controller optimized for connected devices. It provides extremely flexible, high-performance, secured access to any major cloud provider.

• Easy IGBT Power Modules
Suitable for a flexible and scalable power module solution, the Easy IGBT modules include an extension of the Easy 3B package that offers a broad baseplate-less package portfolio with 12mm height. Featuring a flexible pin grid system, Easy family modules are an ideal fit for customizing layout and pinout. These modules can be used to extend current inverter designs when looking to achieve higher power with only a few mechanical modifications.