Bergquist Company
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Henkel’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).
Featured Products by Bergquist Company
Green Energy
Boosts the efficiency of solar power networks, improves alternative energy conversion and storage.
Data Centre Applications
Advanced materials help with thermal management, long-term reliability, and stress protection.
TGP 40000SF 40W/m-K Silicone Free GAP PAD®
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Liqui-Form TLF 10000 10W/m-K Thermal Gel
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.