Analog Devices Inc. EVAL-ADPA1106 Evaluation Board

Analog Devices Inc. EVAL-ADPA1106 Evaluation Board evaluates the ADPA1106 GaN Power Amplifier. The board consists of a 2-layer printed circuit board (PCB) fabricated from a 10-mil thick, Rogers 4350B copper-clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the device and as mechanical support to the PCB. Mounting holes on the heat spreader allow the spreader to be attached to a heat sink. Alternatively, the spreader is clamped to a hot and cold plate. The RFIN and RFOUT ports on the ADPA1106-EVALZ are populated by Subminiature Version A (SMA) female coaxial connectors, and the respective RF traces have a 50 Ω characteristic impedance. The ADPA1106-EVALZ is populated with components suitable for use over the entire operating temperature range of the device. To calibrate board trace losses, a through calibration path is provided between the J6 and J5 connectors. J6 and J5 must be populated with SMA RF connectors to use them through calibration path.