Laird Technologies Tputty™ 910 1-Part Dispensable Gap Filler
Laird Technologies Tputty™ 910 1-Part Dispensable Gap Filler minimizes stress on components during assembly while delivering the reliability of a traditional thermal pad. This soft, compliant solution provides low thermal resistance, high reliability, and low outgassing. Additional benefits include 9.1W/mK thermal conductivity and a minimum bondline thickness as low as 180µm. Laird Technologies Tputty 910 1-Part Dispensable Gap Filler is ready to use and does not require any curing operation. The 910 series also meets RoHS and REACH requirements.
Features
- 9.1W/mK thermal conductivity
- Dispensable and compliant
- Easily reworkable
- Good vertical stability
- Low bondline thickness
- Low outgassing
- Ideal for large gaps
- 180µm minimum bondline thickness
- Meets RoHS and REACH requirements
Applications
- Telecom base stations
- Graphic chips
- Microprocessors
- High-power automotive electronic controls
Resources
Published: 2025-07-23
| Updated: 2025-12-19