NXP Semiconductors i.MX 8X Applications Processors

NXP Semiconductors i.MX 8X Applications Processors extend the range of the i.MX 8 series, with up to four Arm® Cortex®-A35 cores, an Arm Cortex-M4F core for real-time processing, and integrated Cadence® Tensilica® HiFi DSP for audio, voice, and speech processing. The i.MX 8X processors are part of NXP’s EdgeVerse™ edge computing platform. Built with high-level integration to support graphics, video, image processing, audio, and voice functions, the i.MX 8X processor family is ideal for safety-certifiable and efficient performance requirements.

The i.MX 8X Applications Processors are offered in pin- and power-compatible 17mm² and 21mm² Flip-Chip Plastic Ball Grid Array (FCPBGA) packages, with options for consumer/industrial (-40°C to +105°C) and automotive (-40°C to +125°C) temperature ratings.

Features

Up to four 1.2GHz Cortex-A35 processors - a powerful and power-efficient upgrade path for next-generation solutions
Multiple systems, one processor - delivers a high level of integration on one chip, such as the Cortex-A35 applications core, Cortex-M4F real-time processing core, hardware-accelerated graphics and video, high-performance DSP, and more
Optimized power - reduce thermal system cost and power usage by shutting down the Cortex-A35 core while the Cortex-M4F core remains active to perform low-level system monitoring tasks
Optional Error Correcting Code (ECC) - the i.MX 8X Processor with optional ECC supports Industrial Safety Integrity Level 3 (SIL 3) certification for applications such as programmable logic controller (PLC), input/output (I/O) controller, robotic control, and drones

Advanced programmable security - ensure top-of-the-line security with cryptography standards such as AES, flashless SHE, elliptical curve cryptography, and key storage
Multi-domain voice recognition - integrated Tensilica HiFi 4 DSP provides audio pre- and post-processing, keyword detection, and speech recognition for hands-off interaction
Three screens of independent content - develop innovative, multi-screen platforms through the ability to drive up to two 1080p screens, MIPI-DSI or LVDS, and one parallel WVGA display with independent content to reduce system cost
Fully Depleted Silicon on Insulator (FD-SOI) - built using 28nm FD-SOI, the i.MX 8X Applications Processor dramatically improves mean time between failures (MTBF) and reduces latch-ups due to FD-SOI’s inherently high immunity to soft errors
Highly scalable - easily transition between the i.MX 8 family and the i.MX 8X family with its high level of software and hardware reuse across the full range of product capabilities

Applications

Automotive
- Instrument cluster
- Infotainment
- Display audio
- Rear-seat entertainment
Industrial vehicle
- Avionics cockpit display
- In-flight entertainment
- Train and heavy equipment HMI
Advanced industrial human-machine interface (HMI) and control
- PLCs
- I/O controllers
- Home/building control
Robotics
- Drones
- Mobile service robots

Building Control
- Fire and security panel
- Elevator control
- HVAC controls
Healthcare - patient monitoring
Networking
- Specialty gateways
- Video conference terminals
General-purpose HMI solutions
- Mobile payment systems
- Kiosks

Specifications

Processor complex
- 2x / 4x Arm Cortex-A35 cores
- 1x Arm Cortex-M4F core for real-time processing
- 1x Tensilica HiFi 4 DSP
Multimedia
- 1 x 4-Shader GPU, OpenGL® ES 3.1, OpenCL 1.2 Full Profile, OpenVG 1.1, Vulkan
- 4K H.265 dec | 1080p H.264 dec/enc video
Memory
- 16/32-bit DDR3L-1866 and LPDDR4-2400
- 1x Octal SPI or 2x Quad SPI
- ECC capabilities
  - Cortex-A35 L1 cache parity
  - Cortex-A35 L2 cache ECC
  - ECC Protection on DDR interface (i.MX 8QuadXPlus / 8DualXPlus)
Display and cameras
- 2x Combo MIPI DSI (4-lanes) / LVDS (1080p)
- 24-bit Parallel display I/F (WXGA)
- SafeAssure® Fail-over capable display
- 1x 4-lane MIPI CSI2
- 1x parallel 8-bit CSI (BT.656)

Connectivity
- 2x SDIO3.0 (or 1x SDIO3.0 + 1x eMMC5.1)
- USB 2.0 and 3.0 OTG support with PHY
- 2x Ethernet AVB MAC
- 3x CAN / CAN FD
- MOST 25/50
- PCIe 3.0 (1-lane) with L1 substate
- 1x ADC (6-channels)
- 4x SPI, 1x ESAI, 4x SAI, 1x Keypad
- 4x I²C (High-speed), 4x I²C (Low-speed), 1x I²C (M4)
- 1x SPDIF
Security
- High Assurance Boot, SHE
- TRNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5
- RSA-1024, 2048, 3072, 4096, and secure key storage
- 10 Tamper-pins (active and passive)
- Inline Encryption Engine (AES-128)
Temperature grade options
- -40°C to +125°C T_j (Automotive AEC-Q100 Grade 3)
- -40°C to +105°C T_j (Industrial)