Infineon Technologies EasyPACK™ S Modules
Infineon Technologies EasyPACK™ S Modules deliver efficient power conversion in a compact, easy-to-integrate package built for modern power designs. The EasyPACK S family provides customers with a flexible, scalable power module platform featuring one of the broadest package and technology portfolios available. Its adaptable pin grid system simplifies layout and pinout customization for faster, more efficient design integration.
The Infineon Technologies FZ35R12ST4_H18_A features TRENCHSTOP™ IGBT7/4 with an emitter-controlled 7 diode, while the FS25MR12SM2_A incorporates the current generation CoolSiC™ MOSFET 1200V and high-current press-fit pins.
Features
- High-volume production
- Designed for scalable manufacturing
- Supports a high level of automated handling to boost efficiency across the customer production line
- Competitive pricing
- Offers strong cost competitiveness against a wide range of market alternatives
- Includes top-side-cooled devices and molded packages
- Future-ready design
- Built to support next-generation chip technologies
- Engineered to meet demanding lifetime and reliability requirements
- Lower system costs
- High-efficiency power conversion
- Excellent thermal performance
- Compact, flexible design
Applications
- On-board chargers
- EV charging infrastructure
- Industrial drive systems
- Renewable energy applications
Additional Resources
Videos
Published: 2026-06-05
| Updated: 2026-06-12