Ohmite D Series Heatsinks

Ohmite D Series Heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The heatsinks offer a low cost, large surface area, and a small footprint that can dissipate more heat. The unique patent-pending design combines tin-plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263, and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottle-neck” is also eliminated, while the surface area for cooling is maximized with the extruded fins of the D Series body.