|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp301.792
-
178In Stock
|
Mouser Part No
200-LPAM30010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
178In Stock
|
|
|
Rp301.792
|
|
|
Rp275.557
|
|
|
Rp266.200
|
|
|
Rp257.578
|
|
|
Rp207.493
|
|
|
View
|
|
|
Rp247.304
|
|
|
Rp206.209
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp288.950
-
196In Stock
|
Mouser Part No
200-LPAM30010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
196In Stock
|
|
|
Rp288.950
|
|
|
Rp246.203
|
|
|
Rp230.609
|
|
|
Rp219.602
|
|
|
Rp173.553
|
|
|
View
|
|
|
Rp211.713
|
|
|
Rp204.008
|
|
|
Rp152.639
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Plugs
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp501.947
-
391In Stock
|
Mouser Part No
200-LPAM40015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
391In Stock
|
|
|
Rp501.947
|
|
|
Rp426.545
|
|
|
Rp399.576
|
|
|
Rp395.907
|
|
|
Rp342.703
|
|
|
View
|
|
|
Rp395.540
|
|
|
Rp260.880
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp252.074
-
120In Stock
|
Mouser Part No
200-LPAM20015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
120In Stock
|
|
|
Rp252.074
|
|
|
Rp214.281
|
|
|
Rp200.889
|
|
|
Rp191.349
|
|
|
Rp149.887
|
|
|
View
|
|
|
Rp182.543
|
|
|
Rp169.334
|
|
|
Rp137.412
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-2-K-TR
- Samtec
-
1:
Rp583.403
-
454In Stock
|
Mouser Part No
200-LPAM40010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
454In Stock
|
|
|
Rp583.403
|
|
|
Rp495.892
|
|
|
Rp464.888
|
|
|
Rp456.815
|
|
|
Rp398.292
|
|
|
View
|
|
|
Rp357.930
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp289.683
-
162In Stock
|
Mouser Part No
200-LPAM20010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
162In Stock
|
|
|
Rp289.683
|
|
|
Rp246.203
|
|
|
Rp230.793
|
|
|
Rp219.785
|
|
|
Rp174.654
|
|
|
View
|
|
|
Rp212.447
|
|
|
Rp160.894
|
|
|
Rp154.473
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-2-K-TR
- Samtec
-
1:
Rp163.646
-
1.248In Stock
|
Mouser Part No
200-LPAM10010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
1.248In Stock
|
|
|
Rp163.646
|
|
|
Rp139.063
|
|
|
Rp130.440
|
|
|
Rp124.202
|
|
|
Rp120.900
|
|
|
View
|
|
|
Rp120.900
|
|
|
Rp106.223
|
|
Min.: 1
Mult.: 1
:
625
|
|
|
Headers
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp491.306
-
373In Stock
|
Mouser Part No
200-LPAM50010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
373In Stock
|
|
|
Rp491.306
|
|
|
Rp457.916
|
|
|
Rp457.916
|
|
|
Rp354.078
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
400 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-1-K-TR
- Samtec
-
1:
Rp685.773
-
150In Stock
|
Mouser Part No
200-LPAM50010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
150In Stock
|
|
|
Rp685.773
|
|
|
Rp655.686
|
|
|
Rp631.102
|
|
|
Rp584.870
|
|
|
View
|
|
|
Rp456.815
|
|
|
Rp502.313
|
|
|
Rp456.815
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp352.977
-
191In Stock
|
Mouser Part No
200-LPAM30015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
191In Stock
|
|
|
Rp352.977
|
|
|
Rp301.975
|
|
|
Rp294.820
|
|
|
Rp281.428
|
|
|
Rp211.896
|
|
|
View
|
|
|
Rp263.265
|
|
|
Rp198.687
|
|
|
Rp195.385
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp295.187
-
232In Stock
|
Mouser Part No
200-LPAM20015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
232In Stock
|
|
|
Rp295.187
|
|
|
Rp250.973
|
|
|
Rp235.379
|
|
|
Rp224.005
|
|
|
Rp178.323
|
|
|
View
|
|
|
Rp222.354
|
|
|
Rp168.600
|
|
|
Rp168.416
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp303.259
-
185In Stock
|
Mouser Part No
200-LPAM20015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
185In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp279.043
|
|
|
Rp258.495
|
|
|
Rp202.540
|
|
|
View
|
|
|
Rp222.170
|
|
|
Rp201.439
|
|
|
Rp198.687
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-2-K-TR
- Samtec
-
1:
Rp303.259
-
18In Stock
|
Mouser Part No
200-LPAM30015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18In Stock
|
|
|
Rp303.259
|
|
|
Rp289.867
|
|
|
Rp276.107
|
|
|
Rp255.743
|
|
|
Rp189.147
|
|
|
View
|
|
|
Rp219.785
|
|
|
Rp189.331
|
|
|
Rp173.737
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
450
|
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp700.267
-
251In Stock
|
Mouser Part No
200-LPAM50015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
251In Stock
|
|
|
Rp700.267
|
|
|
Rp669.446
|
|
|
Rp644.312
|
|
|
Rp597.162
|
|
|
View
|
|
|
Rp483.784
|
|
|
Rp512.954
|
|
|
Rp483.784
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Samtec LPAM-30-01.0-S-06-1-K-TR
- LPAM-30-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp443.239
-
275In Stock
-
New Product
|
Mouser Part No
200-LPAM30010S061KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
275In Stock
|
|
|
Rp443.239
|
|
|
Rp332.796
|
|
|
Rp332.613
|
|
|
Rp311.882
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp529.832
-
297In Stock
|
Mouser Part No
200-LPAM40010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
297In Stock
|
|
|
Rp529.832
|
|
|
Rp450.394
|
|
|
Rp422.141
|
|
|
Rp421.041
|
|
|
Rp337.933
|
|
|
Rp335.915
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-1-K-TR
- Samtec
-
1:
Rp297.022
-
353In Stock
|
Mouser Part No
200-LPAM30010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
353In Stock
|
|
|
Rp297.022
|
|
|
Rp283.996
|
|
|
Rp273.355
|
|
|
Rp253.542
|
|
|
Rp197.953
|
|
|
View
|
|
|
Rp217.767
|
|
|
Rp204.558
|
|
|
Rp182.176
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
475
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-08-2-K-TR
- Samtec
-
1:
Rp593.677
-
45In Stock
|
Mouser Part No
200-LPAM40015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
45In Stock
|
|
|
Rp593.677
|
|
|
Rp504.515
|
|
|
Rp472.960
|
|
|
Rp465.621
|
|
|
Rp380.313
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
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1:
Rp405.447
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6In Stock
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Mouser Part No
200-LPAM20015S082KTR
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Samtec
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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6In Stock
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Rp405.447
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Rp344.721
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Rp323.073
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Rp307.662
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Rp250.606
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View
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Rp306.929
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Rp235.563
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Rp231.343
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Quote
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Min.: 1
Mult.: 1
:
300
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Headers
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160 Position
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1.27 mm (0.05 in)
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8 Row
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Crimp
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Vertical
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4.5 mm, 5 mm
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2.2 A
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250 VAC
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28 Gbps
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- 55 C
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+ 125 C
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Gold
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Copper Alloy
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Liquid Crystal Polymer (LCP)
|
LPAM
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Reel, Cut Tape
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-2-K-TR
- Samtec
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1:
Rp252.074
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306In Stock
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Mouser Part No
200-LPAM20010L042KTR
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Samtec
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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306In Stock
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Rp252.074
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Rp238.865
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Rp229.692
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Rp212.997
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Rp146.768
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View
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Rp183.093
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Rp182.176
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Rp137.595
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Quote
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Min.: 1
Mult.: 1
:
475
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Headers
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80 Position
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1.27 mm (0.05 in)
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4 Row
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Solder
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Straight
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2.2 A
|
250 VAC
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|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-06-2-K-TR
- Samtec
-
1:
Rp460.118
-
7In Stock
-
600Expected 06/07/2026
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Mouser Part No
200-LPAM40015L062KTR
|
Samtec
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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7In Stock
600Expected 06/07/2026
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Rp460.118
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Rp439.937
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Rp423.426
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Rp392.421
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Rp310.781
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View
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Rp337.199
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Rp305.828
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Quote
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Min.: 1
Mult.: 1
:
300
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LPAM
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Reel, Cut Tape
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-2-K-TR
- Samtec
-
1:
Rp423.976
-
18In Stock
|
Mouser Part No
200-LPAM40010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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|
18In Stock
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Rp423.976
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Rp360.499
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Rp337.933
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Rp322.339
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Rp264.916
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View
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Rp250.606
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Quote
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Min.: 1
Mult.: 1
:
325
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Headers
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240 Position
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1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp450.578
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325Expected 06/07/2026
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Mouser Part No
200-LPAM30010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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325Expected 06/07/2026
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Rp450.578
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Rp430.948
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Rp414.620
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Rp384.349
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Rp280.877
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View
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Rp330.228
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Rp243.818
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Quote
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Min.: 1
Mult.: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-04-1-K-TR
- Samtec
-
475:
Rp253.909
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM40010L041KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
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Non-Stocked Lead-Time 3 Weeks
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Min.: 475
Mult.: 475
:
475
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Reel
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
Rp266.567
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM40015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 450
Mult.: 450
:
450
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Headers
|
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1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|