|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
- 470-2155-100
- Amphenol TCS
-
24:
Rp2.163.544
-
24In Stock
|
Mouser Part No
523-470-2155-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
|
|
24In Stock
|
|
|
Rp2.163.544
|
|
|
Rp2.091.261
|
|
|
View
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
18 mm, 20 mm, 22 mm25 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
- 471-3045-600
- Amphenol TCS
-
20:
Rp1.169.007
-
20In Stock
|
Mouser Part No
523-471-3045-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
|
|
20In Stock
|
|
|
Rp1.169.007
|
|
|
Rp1.130.114
|
|
|
Rp1.068.104
|
|
|
View
|
|
|
Quote
|
|
Min.: 20
Mult.: 20
|
|
|
Plugs
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
12 mm, 15 mm, 20 mm, 25 mm, 28 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
- 470-3155-600
- Amphenol TCS
-
20:
Rp1.056.913
-
20In Stock
|
Mouser Part No
523-470-3155-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
|
|
20In Stock
|
|
|
Rp1.056.913
|
|
|
Rp1.021.505
|
|
|
Rp965.367
|
|
|
View
|
|
|
Quote
|
|
Min.: 20
Mult.: 20
|
|
|
Receptacles
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
18 mm, 20 mm, 22 mm, 25 mm
|
1 A
|
600 V
|
12.5 Gbps
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
- 470-1075-100
- Amphenol TCS
-
40:
Rp240.149
-
Non-Stocked Lead-Time 12 Weeks
|
Mouser Part No
523-470-1075-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
|
Rp240.149
|
|
|
Rp218.501
|
|
|
Rp210.796
|
|
|
Rp205.842
|
|
|
View
|
|
|
Rp200.522
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 12 mm, 14 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
- 470-1075-600
- Amphenol TCS
-
40:
Rp370.222
-
Non-Stocked
|
Mouser Part No
523-470-1075-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp370.222
|
|
|
Rp357.747
|
|
|
Rp337.933
|
|
|
Rp328.210
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 12 mm, 14 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
- 470-1105-100
- Amphenol TCS
-
40:
Rp379.579
-
Non-Stocked
|
Mouser Part No
523-470-1105-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
|
|
Non-Stocked
|
|
|
Rp379.579
|
|
|
Rp366.920
|
|
|
Rp346.556
|
|
|
Rp336.649
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 15 mm, 17 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
- 470-1105-600
- Amphenol TCS
-
40:
Rp306.929
-
Non-Stocked
|
Mouser Part No
523-470-1105-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp306.929
|
|
|
Rp296.655
|
|
|
Rp280.327
|
|
|
Rp272.255
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 15 mm, 17 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
- 470-1155-100
- Amphenol TCS
-
40:
Rp353.161
-
Non-Stocked
|
Mouser Part No
523-470-1155-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
|
|
Non-Stocked
|
|
|
Rp353.161
|
|
|
Rp341.236
|
|
|
Rp322.339
|
|
|
Rp313.166
|
|
|
View
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 20 mm, 22 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
- 470-1155-600
- Amphenol TCS
-
40:
Rp353.161
-
Non-Stocked
|
Mouser Part No
523-470-1155-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp353.161
|
|
|
Rp341.236
|
|
|
Rp322.339
|
|
|
Rp313.166
|
|
|
View
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 20 mm, 22 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
- 470-1205-100
- Amphenol TCS
-
40:
Rp1.160.935
-
Non-Stocked
|
Mouser Part No
523-470-1205-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
|
|
Non-Stocked
|
|
|
Rp1.160.935
|
|
|
Rp1.097.274
|
|
|
View
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 25 mm, 27 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
- 470-1235-100
- Amphenol TCS
-
40:
Rp383.798
-
Non-Stocked
|
Mouser Part No
523-470-1235-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
|
|
Non-Stocked
|
|
|
Rp383.798
|
|
|
Rp370.956
|
|
|
Rp350.409
|
|
|
Rp340.318
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 28 mm, 30 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
- 470-1235-600
- Amphenol TCS
-
40:
Rp474.244
-
Non-Stocked
|
Mouser Part No
523-470-1235-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 100P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp474.244
|
|
|
Rp458.467
|
|
|
Rp433.149
|
|
|
Rp420.674
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 40
Mult.: 40
|
|
|
Receptacles
|
100 Position
|
1.15 mm (0.045 in)
|
10 Row
|
BGA
|
Vertical
|
10 mm, 28 mm, 30 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
- 470-2075-600
- Amphenol TCS
-
24:
Rp335.915
-
Non-Stocked
|
Mouser Part No
523-470-2075-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp335.915
|
|
|
Rp319.771
|
|
|
Rp309.130
|
|
|
Rp292.068
|
|
|
View
|
|
|
Rp283.629
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
10 mm, 12 mm, 14 mm, 17 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
- 470-2105-100
- Amphenol TCS
-
24:
Rp2.115.110
-
Non-Stocked Lead-Time 26 Weeks
|
Mouser Part No
523-470-2105-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
|
|
Non-Stocked Lead-Time 26 Weeks
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
13 mm, 15 mm, 17 mm, 20 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
- 470-2105-600
- Amphenol TCS
-
24:
Rp633.304
-
Non-Stocked
|
Mouser Part No
523-470-2105-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp633.304
|
|
|
Rp612.940
|
|
|
Rp592.392
|
|
|
Rp559.920
|
|
|
View
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
13 mm, 15 mm, 17 mm, 20 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
- 470-2155-600
- Amphenol TCS
-
24:
Rp840.981
-
Non-Stocked
|
Mouser Part No
523-470-2155-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp840.981
|
|
|
Rp812.911
|
|
|
Rp768.330
|
|
|
Rp768.147
|
|
|
View
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
18 mm, 20 mm, 22 mm, 25 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
- 470-2205-100
- Amphenol TCS
-
24:
Rp760.075
-
Non-Stocked
|
Mouser Part No
523-470-2205-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
|
|
Non-Stocked
|
|
|
Rp760.075
|
|
|
Rp735.491
|
|
|
Rp710.908
|
|
|
Rp671.831
|
|
|
View
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
23 mm, 25 mm, 27 mm, 30 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
- 470-2205-600
- Amphenol TCS
-
24:
Rp436.084
-
Non-Stocked
|
Mouser Part No
523-470-2205-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp436.084
|
|
|
Rp415.170
|
|
|
Rp401.227
|
|
|
Rp379.028
|
|
|
View
|
|
|
Rp368.204
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
23 mm, 25 mm, 27 mm, 30 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
- 470-2235-100
- Amphenol TCS
-
24:
Rp791.630
-
Non-Stocked
|
Mouser Part No
523-470-2235-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
|
|
Non-Stocked
|
|
|
Rp791.630
|
|
|
Rp766.129
|
|
|
Rp740.628
|
|
|
Rp699.716
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
26 mm, 28 mm, 30 mm, 33 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Bulk
|
|
|
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
- 470-2235-600
- Amphenol TCS
-
24:
Rp791.630
-
Non-Stocked
|
Mouser Part No
523-470-2235-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
|
|
Non-Stocked
|
|
|
Rp791.630
|
|
|
Rp766.129
|
|
|
Rp740.628
|
|
|
Rp699.716
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 24
Mult.: 24
|
|
|
Receptacles
|
200 Position
|
1.15 mm (0.045 in)
|
20 Row
|
BGA
|
Vertical
|
26 mm, 28 mm, 30 mm, 33 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
- 470-3075-100
- Amphenol TCS
-
20:
Rp851.071
-
Non-Stocked
|
Mouser Part No
523-470-3075-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
|
|
Non-Stocked
|
|
|
Rp851.071
|
|
|
Rp822.635
|
|
|
Rp777.320
|
|
|
Rp777.137
|
|
Min.: 20
Mult.: 20
|
|
|
Receptacles
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
10 mm, 12 mm, 14 mm, 17 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
- 470-3075-600
- Amphenol TCS
-
20:
Rp895.835
-
Non-Stocked
|
Mouser Part No
523-470-3075-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
|
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Non-Stocked
|
|
|
Rp895.835
|
|
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Rp865.931
|
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Rp818.415
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Rp818.232
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View
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Quote
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Min.: 20
Mult.: 20
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Receptacles
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300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
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Vertical
|
10 mm, 12 mm, 14 mm, 17 mm
|
1 A
|
600 V
|
12.5 Gbps
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
Tray
|
|
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Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
- 470-3105-100
- Amphenol TCS
-
40:
Rp1.102.778
-
Non-Stocked
|
Mouser Part No
523-470-3105-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
|
|
Non-Stocked
|
|
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Rp1.102.778
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Rp1.065.903
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Rp1.007.562
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View
|
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Quote
|
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Min.: 40
Mult.: 20
|
|
|
Receptacles
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
13 mm, 15 mm, 17 mm, 20 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
- 470-3105-600
- Amphenol TCS
-
20:
Rp918.768
-
Non-Stocked
|
Mouser Part No
523-470-3105-600
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
|
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Non-Stocked
|
|
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Rp918.768
|
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Rp888.130
|
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Rp839.330
|
|
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Rp839.146
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Quote
|
|
|
Quote
|
|
Min.: 20
Mult.: 20
|
|
|
Receptacles
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
13 mm, 15 mm, 17 mm, 20 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|
|
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
- 470-3155-100
- Amphenol TCS
-
20:
Rp1.003.893
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Non-Stocked
|
Mouser Part No
523-470-3155-100
|
Amphenol TCS
|
Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
|
|
Non-Stocked
|
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Rp1.003.893
|
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Rp970.320
|
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Rp916.933
|
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View
|
|
|
Quote
|
|
Min.: 20
Mult.: 20
|
|
|
Receptacles
|
300 Position
|
1.15 mm (0.045 in)
|
30 Row
|
BGA
|
Vertical
|
18 mm, 20 mm, 22 mm, 25 mm
|
1 A
|
600 V
|
|
- 40 C
|
+ 105 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
NeXLev
|
|
|