- 40 C Multiprotocol Modules

Results: 699
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
TEKTELIC Multiprotocol Modules MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca) Non-Stocked
Min.: 1
Mult.: 1
No
ORCA 863 MHz to 870 MHz 22 dBm Ethernet 3.6 V - 40 C + 70 C 195 mm x 101 mm x 50 mm Bluetooth 5.0 BeiDou, GPS, Galileo, GLONASS Bulk
TEKTELIC Multiprotocol Modules MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca) Non-Stocked
Min.: 1
Mult.: 1
No
ORCA 923 Hz to 928 Hz, 902 Hz to 915 Hz 22 dBm Ethernet 3.6 V - 40 C + 70 C 195 mm x 101 mm x 50 mm Bluetooth 5.0 BeiDou, GPS, Galileo, GLONASS Bulk
Inventek ISM43439-WBP-L151
Inventek Multiprotocol Modules Non-Stocked
Min.: 2.000
Mult.: 2.000
: 2.000

2.4 GHz 17 dBm I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C BLE, Bluetooth 5.2 802.11 b/g/n Reel
Microchip Technology ATWINC3400-MR210CA142-T
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1
: 500
2.4 GHz 18.3 dBm 3 V 4.2 V - 40 C + 85 C u.FL 22.43 mmx 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silicon Labs RS916WS00AC1A3
Silicon Labs Multiprotocol Modules Non-Stocked
Min.: 1
Mult.: 1

18 dBm USB, SDIO 1.75 V 3.63 V - 40 C + 85 C Cut Tape
ADLINK Technology WIFI BT M.2 WIRELESS-AC 9260 INDUS
ADLINK Technology Multiprotocol Modules 802.11a/b/g/n/ac, Wave 2, 2x2, Bluetooth 5, PCIe, USB, M.2 2230Operating Temperature -40-85Intel,9260.NGWGII.NV Non-Stocked
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz M.2, PCIe, USB - 40 C + 85 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
ADLINK Technology EWK-M2-AC9260-ET
ADLINK Technology Multiprotocol Modules INTEL AC9260 IND. WIFI w/ mPCIe converter Non-Stocked
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
ADLINK Technology EWK-M2-AX210-ET
ADLINK Technology Multiprotocol Modules Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV Non-Stocked
Min.: 1
Mult.: 1
M.2, PCIe 3.135 V 3.465 V - 40 C + 80 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
ADLINK Technology EWK-M2-AC9260-ET W MPCIE CONVERTER
ADLINK Technology Multiprotocol Modules INTEL AC9260 IND. WIFI w/ mPCIe converter Non-Stocked
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
ADLINK Technology RedPine Signals RS9113 WIFI/BT KIT
ADLINK Technology Multiprotocol Modules RS9113-NBZ-D3N IEEE802.11a/b/g/n Dual band mPCIe half Card 1T1R+Dual mode BT4.0+Zigbee 802.15.4 USB interface Combo module 1pcs x WIFI/BT Antenna Operating Temperature range: -40 to +85 C Non-Stocked
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 20 dBm 3 V 3.6 V - 40 C + 85 C Bluetooth PCIe 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee)
ADLINK Technology Wi-Fi/BT M.2 Card Wireless-AX210 Ind.
ADLINK Technology Multiprotocol Modules Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV Non-Stocked
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz, 6 GHz PCIe, USB - 40 C + 85 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Jorjin Multiprotocol Modules Based on TI WL1833 and supports 802.11a/b/g/n and BT/BLE 4.2 Non-Stocked
Min.: 1.800
Mult.: 1.800
: 1.800

2.4 GHz, 5 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C 12.8 mm x 12 mm x 1.63 mm Bluetooth 802.11 a/b/g/n Reel
SparkFun Multiprotocol Modules The Digi XBee 3 global cellular module is a compact programmable reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning. A combination of the XBee e Non-Stocked
Min.: 1
Mult.: 1
23 dBm SPI, UART, USB 2.8 V 5.5 V - 40 C + 85 C SMA 43.18 mm x 30.48 mm BLE 3G, LTE-M/NBIoT GNSS
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6 Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace. does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEBE-M2 is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz Bluetooth, USB, UART 3.3 V - 40 C + 85 C MHF4 Tray
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEBE-M2-SP is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in a M.2 card form factor (M.2 Card Type 2230-S3-A-E). It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases fo Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Bulk
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEBE-SMT is a Wi-Fi7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. Non-Stocked Lead-Time 30 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Reel
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEBE-SMT-SP is a Wi-Fi 7 2x2 Tri-band IEEE802.11 be WLAN, Bluetooth 5.3 BR/EDR/HS/LE module in an M.2 LGA Type 1620 Surface Mount form factor. It is based on Qualcomm's QCC2076 chipset. This is ideal for low quantity purchases for e Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEBE 2.4 GHz, 5 GHz, 6 GHz USB - 40 C + 85 C MHF4 Bluetooth WiFi Cut Tape
Silex Technology Multiprotocol Modules 1x1 Wi-Fi+BLE radio /basbnd SDIO EvalMod Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-SDCAC 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Multiprotocol Modules 802.11ac+Bluetooth SDIO card SoC Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEAC2 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Multiprotocol Modules 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module Non-Stocked Lead-Time 26 Weeks
Min.: 500
Mult.: 500
: 500

SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Cut Tape