|
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
- K32W061K
- NXP Semiconductors
-
2.450:
Rp94.115
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-K32W061K
|
NXP Semiconductors
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.450
Mult.: 2.450
|
|
|
BLE 5.0, Zigbee ,Thread
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
|
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
- K32W061Y
- NXP Semiconductors
-
4.000:
Rp94.665
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-K32W061Y
|
NXP Semiconductors
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 4.000
Mult.: 4.000
|
|
|
BLE 5.0, Zigbee ,Thread
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC Secure and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE
- K32W1480VFTBR
- NXP Semiconductors
-
2.000:
Rp94.665
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-K32W1480VFTBR
|
NXP Semiconductors
|
RF System on a Chip - SoC Secure and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3CVP08SC
- NXP Semiconductors
-
1:
Rp421.041
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp421.041
|
|
|
Rp343.070
|
|
|
Rp325.458
|
|
|
Rp294.086
|
|
|
View
|
|
|
Rp281.244
|
|
|
Rp268.219
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3DVK08SC
- NXP Semiconductors
-
1.200:
Rp225.472
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3DVP08SC
- NXP Semiconductors
-
630:
Rp339.218
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD5DVP08SC
- NXP Semiconductors
-
630:
Rp249.873
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD5DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD7DVK08SC
- NXP Semiconductors
-
1.200:
Rp259.229
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD7DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD7DVP08SC
- NXP Semiconductors
-
630:
Rp252.991
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD7DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3CVP08SC
- NXP Semiconductors
-
630:
Rp227.307
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3DVK08SC
- NXP Semiconductors
-
1.200:
Rp207.493
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3DVP08SC
- NXP Semiconductors
-
630:
Rp240.333
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5CVP08SC
- NXP Semiconductors
-
630:
Rp260.880
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5DVK08SC
- NXP Semiconductors
-
1.200:
Rp238.865
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5DVP08SC
- NXP Semiconductors
-
630:
Rp237.764
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC BLE Only KW40_512
- MKW31Z512VHT4R
- NXP Semiconductors
-
2.000:
Rp87.877
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW31Z512VHT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC BLE Only KW40_512
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE 4.2 Wireless Radio
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
900 mV
|
4.2 V
|
6.8 mA
|
6.1 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-48
|
Reel
|
|
|
|
RF System on a Chip - SoC Kinetis W MCU, ARM CM0+
- MKW34A512VFT4
- NXP Semiconductors
-
1:
Rp201.256
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW34A512VFT4
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W MCU, ARM CM0+
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp201.256
|
|
|
Rp155.574
|
|
|
Rp148.419
|
|
|
Rp128.789
|
|
|
View
|
|
|
Rp112.094
|
|
|
Rp108.792
|
|
|
Rp107.691
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
512 kB
|
|
|
|
Tray
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW35A512VFP4
- NXP Semiconductors
-
490:
Rp101.270
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW35A512VFP4
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp101.270
|
|
|
Rp97.417
|
|
|
View
|
|
|
Quote
|
|
Min.: 490
Mult.: 490
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Tray
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW35A512VFP4R
- NXP Semiconductors
-
2.000:
Rp99.619
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW35A512VFP4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Reel
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW36A512VFP4R
- NXP Semiconductors
-
2.000:
Rp101.637
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW36A512VFP4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Reel
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW36A512VHT4R
- NXP Semiconductors
-
2.000:
Rp105.123
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW36A512VHT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
LQFN-48
|
Reel
|
|
|
|
RF System on a Chip - SoC KW37, 48HVQFN
- MKW37A512VFT4R
- NXP Semiconductors
-
2.000:
Rp102.371
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW37A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW37, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC KW38, 48HVQFN
- MKW38A512VFT4
- NXP Semiconductors
-
1:
Rp179.974
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW38A512VFT4
|
NXP Semiconductors
|
RF System on a Chip - SoC KW38, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp179.974
|
|
|
Rp140.163
|
|
|
Rp130.257
|
|
|
Rp119.249
|
|
|
View
|
|
|
Rp113.745
|
|
|
Rp110.443
|
|
|
Rp106.590
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Bluetooth 5.0
|
ARM Cortex M0+
|
2.4 GHz
|
2 Mbps
|
5 dBm
|
- 95.5 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
HVQFN-48
|
Tray
|
|
|
|
RF System on a Chip - SoC KW38, 48HVQFN
- MKW38A512VFT4R
- NXP Semiconductors
-
2.000:
Rp110.076
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW38A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW38, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC KW39, 48HVQFN
- MKW39A512VFT4R
- NXP Semiconductors
-
2.000:
Rp107.141
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW39A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW39, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
Indonesia