UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Results: 40
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Data Rate Series
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket 25In Stock
Rp301.058
Rp273.355
Rp260.330
Rp248.038
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 14/10/2026
Rp244.736
Rp219.969
Rp209.511
Rp199.421
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 14/10/2026
Rp272.255
Rp246.020
Rp234.278
Rp223.087
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 22/10/2026
Rp304.177
Rp276.291
Rp263.082
Rp250.606
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22Expected 11/11/2026
Rp331.696
Rp302.342
Rp288.032
Rp274.273
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 21/10/2026
Rp360.315
Rp329.678
Rp314.084
Rp299.040
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 14/10/2026
Rp214.098
Rp191.899
Rp181.258
Rp172.636
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp412.602
Rp370.589
Rp350.042
Rp333.347
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp230.242
Rp206.393
Rp194.835
Rp185.662
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp235.930
Rp212.080
Rp201.806
Rp192.266
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 12/10/2026
Rp251.340
Rp226.206
Rp215.382
Rp205.108
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp454.064
Rp419.940
Rp399.943
Rp380.863
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp255.560
Rp230.059
Rp219.235
Rp208.777
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp525.429
Rp489.288
Rp465.988
Rp443.790
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22Expected 21/10/2026
Rp270.604
Rp244.552
Rp232.811
Rp221.803
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp287.115
Rp260.146
Rp247.671
Rp235.930
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp302.159
Rp274.456
Rp261.247
Rp248.955
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 12/10/2026
Rp328.577
Rp299.407
Rp285.097
Rp271.521
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 22/10/2026
Rp387.468
Rp355.729
Rp338.851
Rp322.706
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp433.516
Rp389.302
Rp367.837
Rp350.225
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp434.066
Rp400.677
Rp381.597
Rp363.434
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 21/10/2026
Rp545.243
Rp508.368
Rp484.151
Rp461.218
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp565.240
Rp527.998
Rp502.864
Rp478.831
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 22/10/2026
Rp588.540
Rp550.747
Rp524.512
Rp499.562
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket Non-Stocked Lead-Time 10 Weeks
Rp236.480
Rp229.325
Min.: 350
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6