|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-2-K-TR
- Samtec
-
300:
Rp270.604
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM30015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp270.604
|
|
|
Rp231.527
|
|
|
Rp198.504
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
Rp424.160
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAM50010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp424.160
|
|
|
Rp311.148
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp218.684
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp218.684
|
|
|
Rp204.191
|
|
|
Rp193.000
|
|
|
Rp176.672
|
|
|
Rp151.721
|
|
|
View
|
|
|
Rp151.721
|
|
|
Rp129.156
|
|
|
Rp110.443
|
|
Min.: 1
Mult.: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-2-K-FR
- Samtec
-
300:
Rp375.176
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM40015L082KFR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-1-K-TR
- Samtec
-
475:
Rp146.768
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM20010L041KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp146.768
|
|
|
Rp125.670
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-2-K-TR
- Samtec
-
325:
Rp278.676
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM30010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp278.676
|
|
|
Rp238.498
|
|
|
Rp204.374
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-04-2-K-TR
- Samtec
-
475:
Rp154.473
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20010S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp154.473
|
|
|
Rp132.091
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
Rp218.501
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM30010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp218.501
|
|
|
Rp186.946
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
300:
Rp238.865
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAM20015S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp238.865
|
|
|
Rp204.374
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-1-K-FR
- Samtec
-
375:
Rp148.236
-
Non-Stocked Lead-Time 5 Weeks
-
New Product
|
Mouser Part No
200-LPAM10015S061KFR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp148.236
|
|
|
Rp107.874
|
|
|
Rp92.464
|
|
Min.: 375
Mult.: 375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
300:
Rp222.720
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM2001.0L081K
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp222.720
|
|
|
Rp190.615
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
No
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-1-K-TR
- Samtec
-
575:
Rp113.929
-
Non-Stocked Lead-Time 10 Weeks
-
New Product
|
Mouser Part No
200-LPAM10015S041KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp113.929
|
|
|
Rp97.601
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
Rp234.278
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM20010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp234.278
|
|
|
Rp200.522
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-1-K-TR
- Samtec
-
400:
Rp148.603
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp148.603
|
|
|
Rp126.404
|
|
|
Rp92.831
|
|
Min.: 400
Mult.: 400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
Rp108.608
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp108.608
|
|
|
Rp92.831
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
Rp187.313
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAM30015S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp187.313
|
|
|
Rp160.161
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
Rp284.180
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM30015S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp284.180
|
|
|
Rp243.085
|
|
|
Rp208.411
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
Rp108.608
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp108.608
|
|
|
Rp92.831
|
|
Min.: 575
Mult.: 575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp294.637
-
Non-Stocked Lead-Time 10 Weeks
-
New Product
|
Mouser Part No
200-LPAM20010S061KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp294.637
|
|
|
Rp281.795
|
|
|
Rp271.154
|
|
|
Rp251.340
|
|
|
Rp183.643
|
|
|
View
|
|
|
Rp215.932
|
|
|
Rp157.225
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
Rp432.415
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM50015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp432.415
|
|
|
Rp317.202
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-06-2-K-TR
- Samtec
-
300:
Rp284.180
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM40015S062KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp284.180
|
|
|
Rp243.085
|
|
|
Rp208.411
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp340.318
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM30015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp340.318
|
|
|
Rp325.458
|
|
|
Rp313.166
|
|
|
Rp290.417
|
|
|
Rp212.263
|
|
|
View
|
|
|
Rp249.322
|
|
|
Rp181.625
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-1-K-TR
- Samtec
-
450:
Rp149.887
-
Non-Stocked Lead-Time 3 Weeks
-
New Product
|
Mouser Part No
200-LPAM20015L041KTR
New Product
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp149.887
|
|
|
Rp128.239
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
1:
Rp225.289
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010S061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp225.289
|
|
|
Rp210.245
|
|
|
Rp198.871
|
|
|
Rp181.992
|
|
|
Rp156.308
|
|
|
View
|
|
|
Rp156.308
|
|
|
Rp133.009
|
|
|
Rp97.601
|
|
Min.: 1
Mult.: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
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LPAM
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Reel, Cut Tape
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
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300:
Rp222.720
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Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM20010L082KTR
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Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp222.720
|
|
|
Rp190.615
|
|
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Quote
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Quote
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Min.: 300
Mult.: 300
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LPAM
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Reel
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