|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA160GBG4PDUBFC
- FA160GBG4PDUBFC
- ATP Electronics
-
390:
Rp14.102.203
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GBG4PDUBFC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA160GBG4PDUBFI
- FA160GBG4PDUBFI
- ATP Electronics
-
390:
Rp14.168.799
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GBG4PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA160GP43PDUBFC
- FA160GP43PDUBFC
- ATP Electronics
-
60:
Rp14.839.529
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GP43PDUBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA160GP43PDUBFI
- FA160GP43PDUBFI
- ATP Electronics
-
60:
Rp15.606.942
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GP43PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA160GP43PDUBYC
- FA160GP43PDUBYC
- ATP Electronics
-
60:
Rp14.525.446
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GP43PDUBYC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA160GP43PDUBYI
- FA160GP43PDUBYI
- ATP Electronics
-
60:
Rp15.649.138
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA160GP43PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FA20G0EMCPDKBFC
- FA20G0EMCPDKBFC
- ATP Electronics
-
760:
Rp1.692.785
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA20G0EMCPDKBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
ATP Electronics FA20G0EMCPDKBFI
- FA20G0EMCPDKBFI
- ATP Electronics
-
760:
Rp1.706.178
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA20G0EMCPDKBFI
|
ATP Electronics
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA320GBG4PDUBFC
- FA320GBG4PDUBFC
- ATP Electronics
-
390:
Rp27.404.521
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GBG4PDUBFC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA320GBG4PDUBFI
- FA320GBG4PDUBFI
- ATP Electronics
-
390:
Rp27.484.510
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GBG4PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA320GP43PDUBFC
- FA320GP43PDUBFC
- ATP Electronics
-
60:
Rp27.864.272
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GP43PDUBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA320GP43PDUBFI
- FA320GP43PDUBFI
- ATP Electronics
-
60:
Rp29.215.271
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GP43PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA320GP43PDUBYC
- FA320GP43PDUBYC
- ATP Electronics
-
60:
Rp28.708.738
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GP43PDUBYC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA320GP43PDUBYI
- FA320GP43PDUBYI
- ATP Electronics
-
60:
Rp35.588.855
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA320GP43PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FA40G0EMCPDKBFC
- FA40G0EMCPDKBFC
- ATP Electronics
-
760:
Rp3.332.367
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA40G0EMCPDKBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
ATP Electronics FA40G0EMCPDKBFI
- FA40G0EMCPDKBFI
- ATP Electronics
-
760:
Rp3.332.367
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA40G0EMCPDKBFI
|
ATP Electronics
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA80G0BG4PDUBFC
- FA80G0BG4PDUBFC
- ATP Electronics
-
390:
Rp7.384.265
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0BG4PDUBFC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FA80G0BG4PDUBFI
- FA80G0BG4PDUBFI
- ATP Electronics
-
390:
Rp7.437.652
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0BG4PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FA80G0EMCPDKBFC
- FA80G0EMCPDKBFC
- ATP Electronics
-
760:
Rp6.611.348
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0EMCPDKBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
ATP Electronics FA80G0EMCPDKBFI
- FA80G0EMCPDKBFI
- ATP Electronics
-
760:
Rp6.611.348
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0EMCPDKBFI
|
ATP Electronics
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA80G0P43PDUBFC
- FA80G0P43PDUBFC
- ATP Electronics
-
60:
Rp7.469.024
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0P43PDUBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FA80G0P43PDUBFI
- FA80G0P43PDUBFI
- ATP Electronics
-
60:
Rp8.295.694
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0P43PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA80G0P43PDUBYC
- FA80G0P43PDUBYC
- ATP Electronics
-
60:
Rp7.689.176
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0P43PDUBYC
|
ATP Electronics
|
ATP Electronics Commercial Temp (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FA80G0P43PDUBYI
- FA80G0P43PDUBYI
- ATP Electronics
-
60:
Rp8.556.391
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FA80G0P43PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (pSLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp. MLC SD
ATP Electronics FM4G00SD2A8ZAFC
- FM4G00SD2A8ZAFC
- ATP Electronics
-
96:
Rp749.434
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FM4G00SD2A8ZAFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. MLC SD
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 96
Mult.: 32
|
|
|