|
|
ATP Electronics Commercial Temp. MLC microSD
ATP Electronics FM4G00UD2A8ZAFC
- FM4G00UD2A8ZAFC
- ATP Electronics
-
120:
Rp670.913
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FM4G00UD2A8ZAFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. MLC microSD
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 120
Mult.: 120
|
|
|
|
|
ATP Electronics Commercial Temp. MLC SD
ATP Electronics FM8G00SD2A8ZAFC
- FM8G00SD2A8ZAFC
- ATP Electronics
-
96:
Rp1.360.172
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FM8G00SD2A8ZAFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. MLC SD
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 96
Mult.: 32
|
|
|
|
|
ATP Electronics Commercial Temp. MLC microSD
ATP Electronics FM8G00UD2A8ZAFC
- FM8G00UD2A8ZAFC
- ATP Electronics
-
120:
Rp1.261.104
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FM8G00UD2A8ZAFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. MLC microSD
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 120
Mult.: 120
|
|
|
|
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FT128GEMCPDKBFC
- FT128GEMCPDKBFC
- ATP Electronics
-
760:
Rp3.332.367
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT128GEMCPDKBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FT128GEMCPDKBFI
- FT128GEMCPDKBFI
- ATP Electronics
-
760:
Rp3.332.367
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT128GEMCPDKBFI
|
ATP Electronics
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
ATP Electronics FT1T92P48PFUBFC
- FT1T92P48PFUBFC
- ATP Electronics
-
60:
Rp45.873.439
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT1T92P48PFUBFC
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
ATP Electronics FT1T92P48PFUBFW
- FT1T92P48PFUBFW
- ATP Electronics
-
60:
Rp45.923.157
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT1T92P48PFUBFW
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
ATP Electronics FT1T92P48PFUBYC
- FT1T92P48PFUBYC
- ATP Electronics
-
60:
Rp45.889.951
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT1T92P48PFUBYC
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
ATP Electronics FT1T92P48PFUBYW
- FT1T92P48PFUBYW
- ATP Electronics
-
60:
Rp45.973.058
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT1T92P48PFUBYW
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT240GBG4PDUBFC
- FT240GBG4PDUBFC
- ATP Electronics
-
390:
Rp7.384.265
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GBG4PDUBFC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT240GBG4PDUBYC
- FT240GBG4PDUBYC
- ATP Electronics
-
390:
Rp7.384.265
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GBG4PDUBYC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT240GBG4PDUBYI
- FT240GBG4PDUBYI
- ATP Electronics
-
390:
Rp7.437.652
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GBG4PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Commercial Temp (TLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FT240GP43PDUBFC
- FT240GP43PDUBFC
- ATP Electronics
-
60:
Rp7.469.024
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GP43PDUBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp (TLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (TLC) NVMe Gen4 M.2 2230 Embedded Module
ATP Electronics FT240GP43PDUBFI
- FT240GP43PDUBFI
- ATP Electronics
-
60:
Rp8.295.694
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GP43PDUBFI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (TLC) NVMe Gen4 M.2 2230 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp (TLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FT240GP43PDUBYC
- FT240GP43PDUBYC
- ATP Electronics
-
60:
Rp7.689.176
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GP43PDUBYC
|
ATP Electronics
|
ATP Electronics Commercial Temp (TLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Industrial Temp. (TLC) NVMe Gen4 M.2 2230 SED Embedded Module
ATP Electronics FT240GP43PDUBYI
- FT240GP43PDUBYI
- ATP Electronics
-
60:
Rp8.556.391
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT240GP43PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. (TLC) NVMe Gen4 M.2 2230 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FT256GEMCPDKBFC
- FT256GEMCPDKBFC
- ATP Electronics
-
760:
Rp6.611.348
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT256GEMCPDKBFC
|
ATP Electronics
|
ATP Electronics Commercial Temp. -25 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 TLC eMMC
ATP Electronics FT256GEMCPDKBFI
- FT256GEMCPDKBFI
- ATP Electronics
-
760:
Rp6.624.557
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT256GEMCPDKBFI
|
ATP Electronics
|
ATP Electronics I-Temp. -40 C to +85 C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
ATP Electronics FT3T84P48PFUBFC
- FT3T84P48PFUBFC
- ATP Electronics
-
60:
Rp90.799.674
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT3T84P48PFUBFC
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
ATP Electronics FT3T84P48PFUBFW
- FT3T84P48PFUBFW
- ATP Electronics
-
60:
Rp76.936.336
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT3T84P48PFUBFW
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
ATP Electronics FT3T84P48PFUBYC
- FT3T84P48PFUBYC
- ATP Electronics
-
60:
Rp76.936.336
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT3T84P48PFUBYC
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
ATP Electronics FT3T84P48PFUBYW
- FT3T84P48PFUBYW
- ATP Electronics
-
60:
Rp93.524.422
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT3T84P48PFUBYW
|
ATP Electronics
|
ATP Electronics Extended Temp (TLC) NVMe Gen4 M.2 2280 SED Embedded Module
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 60
Mult.: 60
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT480GBG4PDUBFC
- FT480GBG4PDUBFC
- ATP Electronics
-
390:
Rp14.102.203
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT480GBG4PDUBFC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT480GBG4PDUBYC
- FT480GBG4PDUBYC
- ATP Electronics
-
390:
Rp14.102.203
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT480GBG4PDUBYC
|
ATP Electronics
|
ATP Electronics Consumer Temp. -0 C to +70 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|
|
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
ATP Electronics FT480GBG4PDUBYI
- FT480GBG4PDUBYI
- ATP Electronics
-
390:
Rp14.168.799
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-FT480GBG4PDUBYI
|
ATP Electronics
|
ATP Electronics Industrial Temp. -40 C to +85 C NVMe Gen4x2 BGA SSD w/ Heat Sink
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 390
Mult.: 390
|
|
|